Agere Systems Adopts Sigrity’s Unified Package Designer for Single and Multi-die Package Design

Sigrity Delivers Enabling Functionality to Meet the Challenges of Advanced Packaging

Santa Clara, Calif. – Aug. 3, 2006 – Sigrity, Inc., the market leader in signal and power integrity software solutions, today announced that Agere Systems, a global leader in semiconductors for storage, wireless data and enterprise networks, has adopted Unified Package Designer (UPD) for use in the design of its advanced semiconductor packages. Agere chose UPD due to the strength of its advanced feature set to support their complex requirements, primarily related to single and multi-die wire-bonded designs. UPD supports a number of advanced package configurations including: stacked-die, flip chip, chip scale, and system-in-package (SiP).

“Given our long term-success with the Encore product and its technology acquisition by Sigrity, we felt it advantageous to migrate to UPD to maintain support continuity and access to its evolving feature set,” said Rick Sergi, Manager of the IC Package Design Group at Agere Systems. “We are very encouraged by Sigrity’s commitment to provide new and enabling functionality for advanced package design and to add these to the solid foundation already existing in the core product. In addition, we look forward to the introduction of advanced, cross-domain capabilities that Sigrity’s expertise in the area of co-design methodologies promises.”

“Agere’s decision to migrate to UPD signifies the importance of continued support and maintenance while developing some very sophisticated packages,” said Dr. Jiayuan Fang, President of Sigrity. “We’re very pleased Agere has selected UPD and look forward to their guidance and direction as we develop advanced capabilities for stacked and multi-die package design.”

About Sigrity
Sigrity, Inc., a privately held U.S. company incorporated in 1998, delivers advanced software solutions for package physical design and for analyzing power and signal integrity in chips, packages and printed circuit boards. Sigrity’s patented electrical analysis methodologies run orders of magnitude faster than general-purpose electromagnetic tools, helping leading companies in the semiconductor, computer, graphics, communications and networking industries ensure high performance and reduce time to market. The company is headquartered in Santa Clara, Calif., with direct sales and global distribution through worldwide representatives. For more information about how to ensure operational designs by using Sigrity’s package physical design and power and signal integrity analysis solutions, please visit: http://www.sigrity.com.


For more information

Teo Yatman
Sigrity, Inc.
(408) 260-9344 ext. 115
Email Contact

Sarah Miller
ThinkBold Corporate Communications, Inc.
(231) 264-8636
Email Contact



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