Peter Feist, CEO of SIGMA-C, said, "We introduced SOLID+ technology at DAC last year, and now are pleased to provide a proven product that helps companies protect against yield loss by getting things right the first time. We worked diligently during the last year with technology leaders in the industry to develop our SOLID+ product as a bulletproof way to bridge the gap between design and printed wafer results, and enable silicon accuracy."
According to Dennis Wassung, vice president of Equity Research, Advanced Design & Test Technologies, Canaccord Adams, "DFM is an increasingly important and challenging consideration for the semiconductor and EDA industries. The economic commitment required to bring advanced semiconductor products to market is substantial with today's leading-edge process geometries. These considerable investments drive the need for new DFM tools to accurately find, quantify, and fix problems early, before designs are committed to mask and silicon manufacturing."
Takashi Sato, lithography specialist at Toshiba Corporation Semiconductor Company stated, "DFM is a critical concern for reinforcing the company's global leading position in the market for advanced LSI. We have been engaged with SIGMA-C for the past several months to integrate SOLID+ in our methodology as a way to predict how design changes will affect yield and help ensure our designs will work as intended at smaller process nodes."
Solid Precision Base
SIGMA-C's lithography simulation experience includes more than 10 years of close cooperation with technology leaders including the Fraunhofer Institute for Integrated Systems and Device Technology IISB; development of SOLID, established by process developers as the golden simulation model; extensive knowledge of the accuracy needs of major semiconductor companies; essential patents for DFM; and a highly knowledgeable staff, many of whom hold Ph.D. degrees in mathematics and science. The company developed SOLID+ based upon the most comprehensive micro-lithography model for DFM applications.
SIGMA-C is a leading provider of applied simulation software that models semiconductor fabrication from design to manufacture to increase accuracy and reduce costs. Its advanced engineering tools -- optical lithography simulation software, e-beam lithography, optical proximity correction and data analysis -- let users optimize processes prior to actual production, to help increase yields. All leading-edge semiconductor manufacturers use SIGMA-C's tools. Founded in 1987, the company is headquartered in Munich, Germany, with subsidiaries in Santa Clara, Calif., and Tokyo, and an office in Seoul, Korea. For further information about how to significantly improve product yields, cycle times and equipment utilization rates, please visit www.sigma-c.com.
ThinkBold Corporate Communications LLC Sarah Miller, 231-264-8636 Email Contact