SIGMA-C Delivers Precise Image-Aware DFM Product to Eliminate Expensive Design Iterations at 65nm and Below; Proven SOLID+ Micro-Lithography Simulation Tool Extends Simulation Area 200-Fold to Handle Hot Spot Challenges

MUNICH, Germany—(BUSINESS WIRE)—Jan. 9, 2006— SIGMA-C Software AG, the micro-lithography simulation company, today delivered its first Design For Manufacturing (DFM) product, SOLID+, a patented micro-lithography lithography simulation/image verification tool that enables the successful transfer of electronic designs onto printed wafers to help prevent mask failure at 65nm and below. It accurately simulates areas up to 200x larger than previously possible with traditional lithography simulation without compromising the accuracy of the results. Using faster algorithms and 3D capability, it instantly identifies hot spots during the chip/cell design process with full accuracy at the resist level for cells larger than 20 X 20 micrometers, letting designers know if their patterns at smaller process nodes can be accurately produced by a photo resist. SOLID+ is ideal for OPC engineers, memory designers, logic designers and process designers; it seamlessly integrates into companies' existing and established DFM software tool environments, eliminating respins, dramatically reducing mask and engineering wafer costs, and improving chip yield and time to volume manufacturing. Available immediately, SOLID+ is priced from U.S. $140k and also is available with other SIGMA-C modules such as 3D mask and 3D wafer. The company will demonstrate the SOLID+ product at the Electronic Design and Solution Fair in Yokohama, Japan, later this month.

Peter Feist, CEO of SIGMA-C, said, "We introduced SOLID+ technology at DAC last year, and now are pleased to provide a proven product that helps companies protect against yield loss by getting things right the first time. We worked diligently during the last year with technology leaders in the industry to develop our SOLID+ product as a bulletproof way to bridge the gap between design and printed wafer results, and enable silicon accuracy."

According to Dennis Wassung, vice president of Equity Research, Advanced Design & Test Technologies, Canaccord Adams, "DFM is an increasingly important and challenging consideration for the semiconductor and EDA industries. The economic commitment required to bring advanced semiconductor products to market is substantial with today's leading-edge process geometries. These considerable investments drive the need for new DFM tools to accurately find, quantify, and fix problems early, before designs are committed to mask and silicon manufacturing."

Takashi Sato, lithography specialist at Toshiba Corporation Semiconductor Company stated, "DFM is a critical concern for reinforcing the company's global leading position in the market for advanced LSI. We have been engaged with SIGMA-C for the past several months to integrate SOLID+ in our methodology as a way to predict how design changes will affect yield and help ensure our designs will work as intended at smaller process nodes."

Solid Precision Base

SIGMA-C's lithography simulation experience includes more than 10 years of close cooperation with technology leaders including the Fraunhofer Institute for Integrated Systems and Device Technology IISB; development of SOLID, established by process developers as the golden simulation model; extensive knowledge of the accuracy needs of major semiconductor companies; essential patents for DFM; and a highly knowledgeable staff, many of whom hold Ph.D. degrees in mathematics and science. The company developed SOLID+ based upon the most comprehensive micro-lithography model for DFM applications.


SIGMA-C is a leading provider of applied simulation software that models semiconductor fabrication from design to manufacture to increase accuracy and reduce costs. Its advanced engineering tools -- optical lithography simulation software, e-beam lithography, optical proximity correction and data analysis -- let users optimize processes prior to actual production, to help increase yields. All leading-edge semiconductor manufacturers use SIGMA-C's tools. Founded in 1987, the company is headquartered in Munich, Germany, with subsidiaries in Santa Clara, Calif., and Tokyo, and an office in Seoul, Korea. For further information about how to significantly improve product yields, cycle times and equipment utilization rates, please visit

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