Resistive-Open Defect Injection in SRAM Core-Cell: Analysis and Comparison between 0.13 µm and 90 nm Technologies - Technical Paper from DAC 2005

Infineon Technologies AG

Paper by L. Dilillo, P. Girard, S. Pravossoudovitch, A. Virazel, and M. Bastian.

Resistive-open defects appear more and more frequently in VDSM technologies. In this paper we present a study concerning resistive-open defects in the core-cell of SRAM memories. The first target of this work is a comparison of the effect produced by resistive-open defects in the 0.13 µm and 90 nm core-cell. We show that the 90 nm core-cell is more robust than the 0.13 µm core-cell in presence of resistive-open defects. On the other hand we show that dynamic faults are most likely to occur in the 90 nm than in 0.13 µm core-cell. Finally we propose a unique March test solution that ensures the complete coverage of all the extracted fault models for both technologies.


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