Celestry's reliability analysis maximizes performance and yield
PARIS--(BUSINESS WIRE)--March 4, 2002--Celestry Design Technologies, Inc. (San Jose, California, USA), the leading provider of Silicon Accurate Sign-off(TM) physical analysis software and services for the semiconductor and electronics industry, today announced that STMicroelectronics (NYSE: STM - news) has selected Celestry's Hot-Carrier Injection (HCI) analysis products to increase the performance of ST's high-end designs.
To increase circuit performance without risking excessive yield failures, a designer must analyze and address reliability. Celestry's RelPro+(TM), a device-level reliability analyzer, BSIMPro(TM) a model parameter extractor and RelXpert(TM), a circuit-level reliability simulator -- enable designers to intelligently manage performance and yield tradeoffs.
"We focus on maximizing density, performance and yield for our many high-volume circuits," said Philippe Margarshack, Group Vice-President, Central R&D, STMicroelectronics. "With Celestry's products we can design more aggressively in our 0.13um CMOS and BICMOS processes, and obtain higher performance and better density products for our Computer Peripherals and Consumer markets, while at the same time not compromising yield and long-term reliability."
Emmanuel Vincent, Reliability Manager, Central R&D, STMicroelectronics, added, "For our high performance designs, HCI is an important issue. Celestry's products make it easy for our designers to assess and prevent circuit-level reliability issues caused by HCI effects. We are also investigating other process reliability issues like NBTI with Celestry."
"We are very pleased to have our reliability tools selected by ST, a leading global manufacturer of high-performance products," said Dr. Zhihong Liu, President and CEO of Celestry. "The endorsement from ST confirms that yield and performance problems of today's IC processes must be addressed now."
Celestry is the leading provider of physical design and analysis products that enable integrated circuit designers to achieve optimal performance from semi conductor process technologies. The Company offers software and services to electronic and semiconductor companies involved with the design of chips that are used in networking, communication, multimedia and computing products. For more information, visit www.celestry.com or email Email Contact.
Notes to Editors: For more details on how reliability issues like
HCI and NBTI affect IC design performance and manufacturing yield,
please refer to
Acronyms: HCI: Hot-Carrier Injection IC: Integrated Circuit NBTI: Negative Bias Temperature Instability
Celestry, the Celestry logo, Silicon Accurate Sign-off, BSIMPro,
RelPro and RelXpert are trademarks of Celestry Design Technologies,
Inc. All other trademarks and tradenames are the property of their
ValleyPR for Celestry Georgia Marszalek, 650/345-7477 Email Contact www.celestry.com