The market for digital consumer devices is expanding, creating a demand for powerful and energy-efficient SoCs. With the Encounter platform, HiSilicon, formerly Huawei Technologies' ASIC Design Center, reduced its risks in timing closure, signal integrity (SI) and design-for-manufacturing (DFM). HiSilicon achieved maximized quality of silicon (QoS) through improved area, performance and power after wires, and realized a fast route to silicon for its communications device.
With its ongoing collaboration with Cadence and SMIC, HiSilicon can optimize its design, software development and system capabilities, enabling it to compete aggressively in the fast-growing communications market.
"Using the Cadence Encounter platform and SMIC's process, we designed a high-performance device for China's competitive communications market," said Ai Wei, executive vice president of HiSilicon. "The collaboration with Cadence and SMIC helped to reduce the time and costs required to develop a product that meets our customers' specifications. We look forward to using the new Encounter-based reference flow, which should help us deliver cost-sensitive, low-power designs."
"HiSilicon's success is an ideal example of how SMIC collaborates with Cadence to address our customers' most pressing design challenges," said Dr. James Sung, senior vice president of Marketing and Sales at SMIC. "We are pleased to continue our work with Cadence to facilitate SoC design for customers in the growing consumer handheld and portable device markets."
"Cadence's relationships with leading companies in the design chain such as SMIC provide us a unique view into the challenges faced by our customers," said Jan Willis, senior vice president of Industry Alliances at Cadence. "Working closely with SMIC to deliver solutions for leading design centers such as HiSilicon provides customers with enhanced value, a greater chance for design success and a competitive edge for speeding their time to market."
The SMIC and Cadence digital reference flow kit is available to SMIC customers. SMIC customers may request the reference flow by contacting SMIC's Design Services at email@example.com. More information can be found at http://www.cadence.com/datasheets/smic_joint_ds.pdf.
About HiSilicon Technologies
Shenzhen HiSilicon Semiconductor Co., Ltd., the former ASIC Design Center of Huawei Technologies, was established in 1991. After 14 years of development, HiSilicon has become an independent chip designer able to provide solutions such as telecommunication networks, intelligent cards, home networks, and digital media. The company has mastered top-ranking IC design and test technologies and set up an advanced EDA design platform, development flow and specifications. With more than 100 patents, HiSilicon owns IP for hundreds of chips internally-developed. HiSilicon invests more than 20 million USD in R&D annually. HiSilicon presently uses 0.18um and 0.13um technologies in chip design, with maximum scale exceeding 50 million gates.
About Huawei Technologies
Huawei Technologies provides customized network solutions for telecom carriers around the world. Specializing in the research and development and production and marketing of communications equipment, Huawei holds leading positions in the global market in the areas of 3G, next-generation network (NGN), switching, xDSL, optical network,and data communications.
SMIC is the first pure-play advanced IC foundry in China to achieve volume production for 8-inch wafers at 0.25 micron and finer line technologies. Established in April 2000, SMIC is a Cayman Islands company based in Shanghai. The foundry provides customers with a full range of services that include: design services, mask manufacturing, wafer fabrication as well as testing capabilities. For more information, please visit www.smics.com.
Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, printed circuit boards and systems used in consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2004 revenues of approximately $1.2 billion, and has approximately 5,000 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
Cadence, the Cadence logo and Encounter are registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.
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