OCP-IP Hosts Conference Within a Conference at DATE

PORTLAND, Ore.—(BUSINESS WIRE)—March 1, 2005— The Open Core Protocol International Partnership (OCP-IP) will feature a conference-within-conference program at the Design Automation and Test Expo (DATE) held 7-11 March 2005 in Munich, Germany. The Pavilion will host exhibits from several OCP-IP member companies including Sonics, CAST, and MIPS and an open discussion forum in the midst of Europe's largest electronic system design exhibition. The pavilion program will combine expert panel sessions and papers, offering visitors a view into key technical trends and insight into the SoC market of the future.

Papers and panels will encompass the diverse issues surrounding re-usable IP, such as: IP development, purchasing, interconnect, verification and testing, IP quality, network on chip (NoC) and more.

Presentations will be given by many OCP-IP member companies including: Accent, CoWare, First Silicon Solutions, MIPS, Nokia, Prosilog, Texas Instruments, TransEDA, Yogitech, and more. Panels will include: "Network on a Chip: Great idea, but where are the implementations?" "IP from silicon vendors: Good or bad?" "New Paradigm for Design Excellence: What's on the Horizon?" moderated by Gary Smith, and "What is EDA Missing?" hosted by Ulf Schlictmann, University of Munich.

For more information on the OCP-IP DATE Pavilion see www.ocpip.org.

About OCP-IP

The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants are: Nokia (NYSE:NOK), Texas Instruments (NYSE:TXN), STMicroelectronics (NYSE:STM), Toshiba Semiconductor Group (including Toshiba America TAEC), and Sonics. OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. VSIA endorses the OCP socket, and OCP-IP is affiliated with the VSI Alliance. For additional background and membership information, visit www.OCPIP.org.

NOTE: All trademarks and service marks are the property of their respective owners.



Contact:
OCP-IP
Ian Mackintosh, 650-938-2500 ext. 106

Email Contact
or
VitalCom
Joe Basques, 650-366-8212 ext. 202

Email Contact



Review Article Be the first to review this article

Aldec

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Blue Pearl: Best kept Secret in EDA
More Editorial  
Jobs
Technical Support Engineer EU/Germany/UK for EDA Careers at N/A, United Kingdom
FPGA Engineer for Teradyne Inc at San Jose, CA
Analog Hardware Engineer for Teradyne Inc at San Jose, CA
Senior R&D Engineer...Timing Closure Specialist for EDA Careers at San Jose or Anywhere, CA
Senior Front-End RTL Design AE for EDA Careers at San Jose, CA
Field Application Engineer for Teradyne Inc at San Jose, CA
Upcoming Events
CODES+ISSS 2017, Oct 15-20, 2017, Lotte Hotel, Seoul, South Korea at Lotte Hotel Seoul Korea (North) - Oct 15 - 20, 2017
DVCon 2017 Europe, Oct 16 - 17, 2017, Munich, Germany at Holiday Inn Munich City Centre Munich Germany - Oct 16 - 17, 2017
11th International Symposium on Networks-on-Chip (NOCS 2017) at Seoul Korea (South) - Oct 19 - 20, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise