OCP-IP Hosts Conference Within a Conference at DATE

PORTLAND, Ore.—(BUSINESS WIRE)—March 1, 2005— The Open Core Protocol International Partnership (OCP-IP) will feature a conference-within-conference program at the Design Automation and Test Expo (DATE) held 7-11 March 2005 in Munich, Germany. The Pavilion will host exhibits from several OCP-IP member companies including Sonics, CAST, and MIPS and an open discussion forum in the midst of Europe's largest electronic system design exhibition. The pavilion program will combine expert panel sessions and papers, offering visitors a view into key technical trends and insight into the SoC market of the future.

Papers and panels will encompass the diverse issues surrounding re-usable IP, such as: IP development, purchasing, interconnect, verification and testing, IP quality, network on chip (NoC) and more.

Presentations will be given by many OCP-IP member companies including: Accent, CoWare, First Silicon Solutions, MIPS, Nokia, Prosilog, Texas Instruments, TransEDA, Yogitech, and more. Panels will include: "Network on a Chip: Great idea, but where are the implementations?" "IP from silicon vendors: Good or bad?" "New Paradigm for Design Excellence: What's on the Horizon?" moderated by Gary Smith, and "What is EDA Missing?" hosted by Ulf Schlictmann, University of Munich.

For more information on the OCP-IP DATE Pavilion see www.ocpip.org.

About OCP-IP

The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants are: Nokia (NYSE:NOK), Texas Instruments (NYSE:TXN), STMicroelectronics (NYSE:STM), Toshiba Semiconductor Group (including Toshiba America TAEC), and Sonics. OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. VSIA endorses the OCP socket, and OCP-IP is affiliated with the VSI Alliance. For additional background and membership information, visit www.OCPIP.org.

NOTE: All trademarks and service marks are the property of their respective owners.



Contact:
OCP-IP
Ian Mackintosh, 650-938-2500 ext. 106

Email Contact
or
VitalCom
Joe Basques, 650-366-8212 ext. 202

Email Contact



Review Article Be the first to review this article

Featured Video
Jobs
Applications Engineer for intersil at Palm Bay, FL
Senior Formal FAE Location OPEN for EDA Careers at San Jose or Anywhere, CA
Senior Electrical Engineer for Allen & Shariff Corporation at Pittsburgh, PA
Principle Electronic Design Engr for Cypress Semiconductor at San Jose, CA
ASIC Hardware Engineer for BAE Systems Intelligence & Security at Arlington, VA
Upcoming Events
IPC APEX EXPO 2018 at San Diego Convention Center San Diego CA - Feb 24 - 1, 2018
DVCon US 2018 at Double Tree Hotel San Jose CA - Feb 26 - 1, 2018
5th EAI International Conference on Big data and Cloud Computing Challenges at Vandalur, Kelambakkam high road chennai Tamil Nadu India - Mar 8 - 9, 2018
DownStream: Solutions for Post Processing PCB Designs



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise