Papers and panels will encompass the diverse issues surrounding re-usable IP, such as: IP development, purchasing, interconnect, verification and testing, IP quality, network on chip (NoC) and more.
Presentations will be given by many OCP-IP member companies including: Accent, CoWare, First Silicon Solutions, MIPS, Nokia, Prosilog, Texas Instruments, TransEDA, Yogitech, and more. Panels will include: "Network on a Chip: Great idea, but where are the implementations?" "IP from silicon vendors: Good or bad?" "New Paradigm for Design Excellence: What's on the Horizon?" moderated by Gary Smith, and "What is EDA Missing?" hosted by Ulf Schlictmann, University of Munich.
For more information on the OCP-IP DATE Pavilion see www.ocpip.org.
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants are: Nokia (NYSE:NOK), Texas Instruments (NYSE:TXN), STMicroelectronics (NYSE:STM), Toshiba Semiconductor Group (including Toshiba America TAEC), and Sonics. OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. VSIA endorses the OCP socket, and OCP-IP is affiliated with the VSI Alliance. For additional background and membership information, visit www.OCPIP.org.
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OCP-IP Ian Mackintosh, 650-938-2500 ext. 106 Email Contact or VitalCom Joe Basques, 650-366-8212 ext. 202 Email Contact