DesignCon Celebrates More than 40 Professionals with 2017 Awards for Best Papers

DesignCon 2018 Call for Papers Opens Mid-May

SAN FRANCISCO, April 18, 2017 — (PRNewswire) —  DesignCon, the premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, announces the recipients of its Best Paper Awards following a successful DesignCon 2017 in Santa Clara, CA, on January 19-21. The winners are recognized for their outstanding contribution to the diverse educational goals of DesignCon. To view the full list of winners, visit:  http://ubm.io/2pvrEHk   

The 2017 DesignCon Best Paper Award winners have been selected through a two-step review process. First, the DesignCon Technical Program Committee, which is comprised of leading experts in the electronic design space, reviewed all papers for impact, relevance, quality, and originality. The first-round finalists were then judged based on attendee feedback, collected at DesignCon 2017, on the impact of their presentation. 

"Congratulations to all finalists and winners of this year's Best Paper Awards. UBM is pleased to recognize these outstanding papers as the best of the excellent content that DesignCon offers its attendees," said Naomi Price, DesignCon Conference Content Director. "Each year, this awards program inspires engineers to strive to produce ground-breaking, top-tier content for the technical sessions at DesignCon."

Winning papers cover four categories of design: Chip-Level Design, Board/System-Level Design, Serial Link Design, and Power & RF Design. A list of the winners is below:

Chip-Level Design

Characterizing and Selecting the VRM

 

Steve Sandler, Picotest

   

Board/System-Level Design

FastBER: A Novel Statistical Method for Arbitrary Transmitter Jitter

 

Yunhui Chu, Intel Corporation

 

Alaeddin Aydiner, Intel Corporation

 

Kai Xiao, Intel Corporation

 

Beomtaek Lee, Intel Corporation

 

Dan Oh, Samsung Electronics

 

Oleg Mikulchenko, Intel Corporation

 

Adam Norman, Intel Corporation Rob Friar, Intel Corporation

 

Charles Phares, Intel Corporation

   

Non-Destructive Analysis and EM Model Tuning of PCB Signal Traces using the Beatty Standard

 

Heidi Barnes, Keysight Technologies

 

José Moreira, Advantest

 

Manuel Walz, Advantest

   

RX IBIS-AMI Model Silicon Correlation Metrics and Model Development Methodology

 

Masashi Shimanouchi, Intel Corporation

 

Hsinho Wu, Intel Corporation

 

Mike Peng Li, Intel Corporation

   

Serial Link Design

Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE

 

Jan B. Preibisch, Technische Universität Hamburg-Harburg

 

Torsten Reuschel, Technische Universität Hamburg-Harburg

 

Katharina Scharff, Technische Universität Hamburg-Harburg

 

Jayaprakash Balachandran, Cisco Systems Inc.

 

Bidyut Sen, Cisco Systems Inc.

 

Christian Schuster, Technische Universität Hamburg-Harburg

   

Investigation of Mueller-Muller CDR Algorithms in PAM4 High speed Serial Links

 

Yuhan Yao, Oracle Corporation

 

Xun Zhang, Oracle Corporation

 

Dawei Huang, Oracle Corporation

 

Jianghui Su, Oracle Corporation

 

Muthukumar Vairavan, Oracle Corporation

 

Chai Palusa, Oracle Corporation

   

PCIe Gen4 Standards Margin Assisted Outer Layer Equalization for Cross Lane Optimization in a 16GT/s PCIe Link

 

Mohammad S. Mobin, Broadcom Ltd

 

Haitao Xia, Broadcom Ltd

 

Aravind Nayak, Broadcom Ltd

 

Gene Saghi, Broadcom Ltd

 

Christopher Abel, Broadcom Ltd

 

Lane Smith, Broadcom Ltd

 

Jun Yao, Broadcom Ltd

   

Power & RF Design

Cost-effective PCB Material Characterization for High-volume Production Monitoring

 

Yongjin Choi, Hewlett-Packard Enterprise

 

Christopher Cheng, Hewlett-Packard Enterprise

 

Yasin Damgaci, Hewlett-Packard Enterprise

 

Nagaraj Godishala, Hewlett-Packard Enterprise

 

Yuriy Shlepnev, Simberian

   

Overview and Comparison of Power Converter Stability Metrics

 

Joseph 'Abe' Hartman, Oracle

 

Alejandro 'Alex' Miranda, Oracle

 

Kavitha Narayandass, Oracle

 

Alexander Nosovitski, Oracle

 

Istvan Novak, Oracle

   

RFI and Receiver Sensitivity Analysis in Mobile Electronic Devices

 

Antonio Ciccomancini Scogna, Samsung Electronics Mobile Division, HE Group

 

Hwanwoo Shim, Samsung Electronics Mobile Division, HE Group

 

Jiheon Yu, Samsung Electronics Mobile Division, HE Group

 

Chang-Yong Oh, Samsung Electronics Mobile Division, HE Group

 

Seyoon Cheon, Samsung Electronics Mobile Division, HE Group

 

NamSeok Oh, Samsung Electronics Mobile Division, HE Group

 

Dong Sub Kim, Samsung Electronics Mobile Division, HE Group

   

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