EL SEGUNDO, Calif. – Mar. 28, 2016
Students at Nanjing University of Posts and Telecommunications recently used NI AWR Design Environment™ to design a novel broadband substrate interconnection structure that overcomes issues associated with using bond wires in microwave systems, which limits operating bandwidth. The designers developed a broadband interconnection using double bond wires with square-shaped defected ground structure under open stubs, which enabled the designers to increase the characteristic impedance of the microstrip line without narrowing its width.
“Using Microwave Office and AXIEM to simulate and optimize this novel broadband interconnection structure gave us the insight we needed to overcome the challenges and develop a successful design,” said Dr. Zhou, professor at Nanjing University of Posts and Telecommunications.
The complete success story can be viewed at http://www.awrcorp.com/customer-stories/nanjing-university-posts-and-telecommunications.