Lattice’s MachXO3L™ Family Named One of the 2014 Hot 100 Products by UBM Canon’s EDN
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Lattice’s MachXO3L™ Family Named One of the 2014 Hot 100 Products by UBM Canon’s EDN

HILLSBORO, Ore. — (BUSINESS WIRE) — November 24, 2014 — Lattice Semiconductor Corporation (NASDAQ: LSCC), the leader in ultra-low power, small form factor, customizable solutions, today announced that its MachXO3L™ FPGA family has been chosen by EDN as one of the “100 Hot Products of 2014.” The 2014 EDN Hot 100 highlights the electronics industry’s most significant products of the year based on innovation, significance, usefulness and popularity.

The MachXO3L family is the world’s most advanced programmable platform for expanding system capabilities and bridging emerging connectivity interfaces using both parallel and serial I/O, in packages as small as 2.5 mm x 2.5 mm. MachXO3L devices combine small-footprint packaging with on-chip resources to simplify the implementation of emerging connectivity interfaces – such as MIPI®, CSI and DSI – as well as robust control and connectivity interfaces, including SPI and I2C hard IP. By using advanced package technology to eliminate bond wires and enable lowest-cost and increased I/O density in a small footprint, the MachXO3L family can be used in multiple market segments, including consumer, communications, compute, storage, industrial and automotive.

“EDN’s selection of our MachXO3L family as one of its Hot 100 Products is a tremendous recognition of how it enables manufacturers across a variety of industries to speed their product development,” said Jim Tavacoli, Senior Director of Vertical Markets and Products at Lattice. “Manufacturers are leveraging the MachXO3L devices’ combination of low power architecture and small form factor packaging to ensure that their products meet the ever increasing requirements for higher performance with lower power consumption.”

“Of the many thousands of products announced during the past year, the EDN Hot 100 are the products that especially caught the attention of our editors and readers. We are pleased to share the tradition of showcasing these technologies as we celebrate the 21st anniversary of this program,” said Rich Pell, Executive and Chief Technical Editor, EDN.

The complete list of EDN’s Hot 100 products can be found online at:

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the leader in low power, small form factor, low-cost, customizable solutions for a quickly changing connected world. From making smart consumer devices smarter, to enabling intelligent industrial automation, or connecting anything to everything in communications, electronics manufacturers around the world use Lattice’s solutions for fast time to market, product innovation, and competitive differentiation. For more information, visit You can also follow us via LinkedIn, Twitter, Facebook or RSS.

About EDN

EDN is an online community intended to help engineers get from concept to reality. EDN offers deep-dive technical content along with a community experience where the latest in design techniques, technologies, and methodologies meld with the simplest and most useful online interaction tools. EDN celebrates all that is the engineer – from deep down technical views, to informed opinions, to knowledge and schematics sharing, to creative design and all aspects of life as an engineer. From day one, EDN has been written by engineers, for engineers, feeding design know-how and experience back to the engineering community as a trusted source. EDN is part of UBM Canon, the leading B-to-B event producer, publisher, and digital media company for the world’s $3 trillion advanced, technology-based manufacturing industry.

Lattice Semiconductor Corporation, Lattice Semiconductor (& design), L (& design), MachXO3L, and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

MIPI® is a registered trademark owned by MIPI Alliance.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.


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