Cadence will showcase its joint development of advanced design technologies in partnership with the Common Platform Alliance (Samsung Electronics, IBM, and GLOBALFOUNDRIES) at the Common Platform Technology Forum on Feb. 5. Attendees can learn more about 20-nanometer and 14-nanometer FinFET standard cell and IP design, physical implementation, and extraction, timing and power signoff, as well as recent 14-nanometer tapeouts in which Cadence was involved.
In addition, Dr. Vassilios Gerousis, distinguished engineer and technologist at Cadence Design Systems (
More information is available on the Cadence Web site.
- Cadence will be at Booth #401 in the Pavilion at the Santa Clara Convention Center
- Gerousis' presentation will be in the Mission City Ballroom
- The Cadence booth will be open Feb. 5 from 11:30 a.m. to 6 p.m.
- The presentation will be Feb. 5 from 3:50 p.m. to 4:50 p.m.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
For more information, please contact: Dean Solov Cadence Design Systems Email Contact (408) 944-7226