TSMC Recognizes Cadence With Two "Partner of the Year" Awards

SAN JOSE, CA -- (Marketwire) -- Oct 29, 2012 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, was presented two "Partner of the Year" awards from TSMC for the contributions Cadence engineers made in the emerging areas of 3D-IC and 20-nanometer chip development. The awards -- for "CoWoS Design Enablement and Test Vehicle Development" and "Joint Delivery of the 20-Nanometer Reference Flow" -- recognize the expertise, technology leadership and commitment Cadence brought to the table as it has worked tightly with its long-standing foundry partner to enable advanced chip design and manufacture.

"TSMC's partner awards are testament to the power of collaboration," said Chi-ping Hsu, senior vice president, research and development, Silicon Realization Group at Cadence. "By working so closely together and for so many years, we are able to offer our customers an easier path past the most daunting challenges they face in the key areas of 3D-IC and 20-nanometer design. Whereas we proudly accept these awards, the real winners are our customers."

"These awards recognize the engineering contribution from Cadence that has enabled 3D-IC and 20-nanometer design," said Suk Lee, TSMC senior director of the Design Infrastructure Marketing Division of TSMC. "Cadence continues to provide advanced technology and collaborates closely with TSMC to enable significant advances in semiconductor and system design."

TSMC recently selected Cadence® solutions for its 20-nanometer design infrastructure. The solutions include the Virtuoso® custom/analog and Encounter® RTL-to-signoff platforms. TSMC also validated Cadence 3D-IC technology for its CoWoS (chip-on-wafer-on-substrate) Reference Flow; the companies developed a CoWoS test vehicle that includes Cadence Wide I/O memory controller and PHY IP.

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2134967
Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2134970

Add to Digg Bookmark with del.icio.us Add to Newsvine

For more information, please contact:
Dean Solov
Cadence Design Systems, Inc.

Email Contact 

Review Article Be the first to review this article


Featured Video
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
Upcoming Events
SEMICON Europe at Grenoble France - Oct 25 - 27, 2016
ARM TechCon 2016 at Santa Clara Convention Center Santa Clara CA - Oct 25 - 27, 2016
Call For Proposals Now Open! at Santa Clara Convention Center, Santa Clara, CA California CA - Oct 25 - 27, 2016
DeviceWerx - 2016 at Green Valley Ranch Casino & Resort Las Vegas NV - Nov 3 - 4, 2016
S2C: FPGA Base prototyping- Download white paper
TrueCircuits: IoTPLL

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy