MIPI® Alliance Features New Specifications, Member Demos and Presentations at Mobile World Congress
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MIPI® Alliance Features New Specifications, Member Demos and Presentations at Mobile World Congress

PISCATAWAY, N.J., Jan. 16, 2012 — (PRNewswire) — MIPI Alliance today announced that 18 member companies representing the mobile device ecosystem will participate in its booth at the 2012 Mobile World Congress, February 27 to March 1 in Barcelona, Spain. In addition, the industry-leading mobile interface standards organization will announce two new specifications – a single-wire battery communications interface and a low-latency chip-to-chip interface.  Demos and presentations will address all aspects of interface implementation, reflecting the mobile device ecosystem. Visit the MIPI Alliance booth in Hall 7, stand 7H10. For more information, go to www.mipi.org/news-events/mobile-world-congress.

The following member companies will participate in the MIPI Alliance booth:
Agilent Technologies
Analogix
Cadence
HDL Design House
Infineon Technologies AG
LeCroy
Mixel, Inc.
Nujira Ltd.
Quantance, Inc.
Renesas Electronics Corp.
Sequans Communications
Silicon Line GmbH
ST-Ericsson
Synopsys, Inc.
Texas Instruments, Inc.
TOSHIBA CORPORATION
WiSpry, Inc.
VLSI Plus, Ltd.

About MIPI Alliance
MIPI Alliance is a global, collaborative organization comprised of companies that span the mobile ecosystem and are committed to defining and promoting interface specifications for mobile devices. MIPI Specifications establish standards for hardware and software interfaces which drive new technology and enable faster deployment of new features and services. For more information, visit www.mipi.org.

MIPI® is a registered mark of MIPI Alliance, Inc. 

Media Contact:
Marcia Barnett
214-868-8861
Email Contact

SOURCE MIPI Alliance

Contact:
MIPI Alliance
Web: www.mipi.org