Nimbic to Chair Panel on Novel RF and Chip-to-Chip Interconnects and Present Paper on Towards System-Level Electromagnetic Field Simulation on Computing Clouds at EPEPS
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Nimbic to Chair Panel on Novel RF and Chip-to-Chip Interconnects and Present Paper on Towards System-Level Electromagnetic Field Simulation on Computing Clouds at EPEPS

MOUNTAIN VIEW, CA – October 18, 2011 – Nimbic, a leading provider of SaaS-based, cloud-computing 3D Fullwave Electromagnetic (EM) Integrity solutions for Signal Integrity (SI), Power Integrity (PI) and Electromagnetic Interference (EMI) and a Silver Sponsor of the Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2011, today announced that Dr. Dipanjan Gope, Nimbic Vice President of R&D, will present a paper on “Towards System-Level Electromagnetic Field Simulation on Computing Clouds” and Daniel de Araujo, Nimbic Director of Applications, will chair a panel on “Novel RF and Chip-to-Chip Interconnects” to be held at the EPEPS 2011 conference in San Jose, California. 

WHAT:   Session: Parallel EM Computing for Packages

        Paper: Towards System-Level Electromagnetic Field Simulation on Computing Clouds

WHERE:  EPEPS 2011, Doubletree Hotel, San Jose, California, Room: Donner/Siskiyou

WHEN:   Wednesday, October 26, 2011 10:20am – 11.00am

WHO:    Chairs: Stefano Grivet Talocia, Politecnico Di Torino, Italy

             Jianming Jin, UIUC, Urbana Champaign

        Paper presented by: Dr. Dipanjan Gope, Nimbic

 

WHAT:   Novel RF and Chip-to-Chip Interconnects

WHERE:  EPEPS 2011, Doubletree Hotel, San Jose, California, Room: Donner/Siskiyou

WHEN:   Monday, October 24, 2011 11.05am – 12.05am

WHO:    Chairs: Daniel de Araujo, Nimbic, Inc. Mountain View

        Hartmut Grabinski, University of Hannover, Germany

 

About Nimbic

Nimbic is the leading provider of SaaS-based, cloud-computing electronic design automation (EDA) 3D Fullwave Electromagnetic (EM) Integrity solutions. Nimbic enables high-speed and high-capacity 3D electromagnetic signal integrity, power integrity and EMI analysis field solutions for the microelectronics industry. Nimbic’s global customers include Texas Instruments, Renesas, Toshiba, Qualcomm, Tabula and Panasonic.  Nimbic’s nCloud solution facilitates efficient and robust chip-package-system co-design while significantly reducing time-to-market and costs.  Nimbic’s accelerated technology delivers unprecedented capacity handling, significantly faster speed than current methodologies, and the ability to span the entire design cycle in 3DIC, package and system simulations, while maintaining uncompromising Maxwell accuracy.

For additional information, please visit  www.nimbic.com.

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Media Contact:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213 media@nimbic.com