New TechZONE at SEMICON West Explores Cross-Supply Chain Collaboration

Amkor, ASE Group, GLOBALFOUNDRIES, IBM, Optimal Test, Samsung, Verigy, Toppan and More— All Exhibiting at First-ever Advanced Technology Manufacturing TechZONE  

SAN JOSE , Calif. — June 23, 2011 — Increased complexity in the design and function of today's microelectronics is requiring greater attention to collaboration across the design-manufacturing supply chain. 3D-IC, SiP, SoC, new materials, and new device architectures add levels of complication that necessitate a better dialogue between designers, equipment and materials companies in addition to manufacturers, to assure that devices are designed with manufacturing, test, and packaging in mind. This year for the first time, SEMICON West (July 12-14) will directly address the need for design-manufacturing supply chain collaboration and communication, providing technical sessions and a specialized exhibit and networking area — the Advanced Technology Manufacturing TechZONE — focused on the design to production test process flow.

"SEMICON West has long been a proven platform for engineers, device makers, and suppliers to engage in addressing technical issues and challenges in manufacturing," says Karen Savala, president of SEMI Americas, organizer of SEMICON West. "As the design community has expanded into the fabless space, and as the complexities of device manufacturing increase, there is a need and an opportunity for SEMICON West to widen its scope, to bring these new audiences together at the show, and to create a platform for creativity, communication and collaboration."

Participating exhibitors at the Advanced Technology Manufacturing TechZONE span the industry supply chain, including software (Mentor Graphics), foundries and device makers (GLOBALFOUNDRIES, IBM Fishkill, Samsung America), packaging and test companies (Amkor Technology, ASE), and semiconductor test equipment (Verigy, Optimal Test). Other exhibitors include the College of Nanoscale Science and Engineering (CNSE), CONNECTEC Japan, SET Smart Equipment Technology (SET), SOLTEC/NEC Avio, and Toppan Photomasks.

On the nearby TechXPOT technical presentation stage, two panel discussions will focus on design and manufacturing topics. The first, Improving Yield (Tuesday, July 12 from 10:30am-11:35am, NorthTwo TechXPOT), will look at improving yield from front-end design “must haves” such as ESL modeling and built-in test, to back-end restrictive design rules; lithography advances such as EUV and computational scaling; pattern optimization; the effects of CMP and new substrate options; and the future effects of Moore’s Law and 2.5D/3D stacking. Panelists include Applied Materials, GLOBALFOUNDRIES, PDF Solutions, Tela Innovations, and Texas Instruments.

The second design-manufacturing panel, Stacking Effects (Tuesday, July 12 from 11:40am-12:45pm, NorthTwo TechXPOT), will look at how 2.5D and 3D technologies will change the global supply chain and explore questions of collaboration and integration of design and manufacturing technologies involving IP from multiple vendors, multiple vendor tools, different process technologies, and companies that have never had to work together in the past. Confirmed panelists include speakers from ARM, eSilicon, Open Silicon, Qualcomm, and Tessera Technologies.

On Wednesday, July 13, SEMI and the Silicon Integration Initiative (Si2) will present a workshop on “ DFM Standards: Driving Design Ecosystems from PDK's to Manufacturing,” including presentations from Cadence, IBM, LSI, Mentor Graphics, Springsoft, and Texas Instruments. The workshop will be held from 1:00-4:00pm in Room 124 in the Lower North Hall Lobby at Moscone Center.

The challenges—and costs—of greater integration and collaboration across the supply chain are particularly risky for start-ups and fabless companies bringing new products to market, as well for IDMs, research organizations, and universities. The Enabling Advanced Technology Prototype/Pilot Design and Manufacturing session (Thursday, July 14, 10:30am-12:30pm, NorthTwo TechXPOT), will highlight the unique pilot scale design and manufacturing services available to facilitate the rapid commercialization of new and innovative products. Speakers represent Toppan Photomasks, College of Nanoscale Science and Engineering at the University at Albany, University of Washington, SVTC Technologies, Mosis, and eSilicon.

Register to attend SEMICON West at www.semiconwest.org

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bengaluru, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

Association Contact

Deborah Geiger/SEMI
Tel: 1.408.943.7988
E-mail: Email Contact

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