Si2 to Host “Synergies in IC Design: PDKs and DFM Standards Working Together” Co-Located Event at DAC 2011

AUSTIN, Texas — (BUSINESS WIRE) — May 4, 2011 — The Silicon Integration Initiative (Si2) today announced the “Synergies in IC Design: PDKs and DFM Standards Working Together” co-located event being hosted at the Design Automation Conference (DAC) show to be held at the San Diego Convention Center, San Diego, CA, from June 5-9, 2011. The “Synergies in IC Design: PDKs and DFM Standards Working Together” event will be held on June 6, from 8:30 a.m. – 12:00 p.m. in Room 29AB in the San Diego Convention Center. In consideration of today’s economic conditions, Si2 is pleased to offer this co-located event free of charge. Attendees can register at the DAC website: http://www2.dac.com/registration.aspx under Co-Located Events.

The complexity of processes and rules needed to ensure the manufacturability of ICs is increasing rapidly with every new technology node. Many of the issues involving Process Design Kits (PDK’s) and Design for Manufacturability (DFM) are interrelated and can be simplified, if not eliminated, by standardized industry practices. This workshop will highlight those interrelated standards and showcase the ongoing work being done by industry leaders in solving these problems.

PDKs are the fundamental building blocks for all electronic design. Standardized representation of PDK content and interfaces will offer operating efficiencies to foundries, EDA companies, IP providers and design companies who use the PDK’s, create their own kits or need to modify those that they receive from their foundries. Resultant PDK’s are expected to be more robust and portable than ever before.

In the DFM arena, standardization has proceeded along 2 parallel fronts. In physical DFM, a standard high-level DFM verification and optimization language called OpenDFM has been defined to support the needs of manufacturability and PDK generation. OpenDFM rules bridge the gap between a layout style that allows only a few, very restricted layout patterns and a style that allows purely arbitrary layouts. Second, there is ongoing effort to standardize a common format for representing parasitic information and to better handle manufacturing variability. This has implications in how this data is represented in PDK’s and how they affect the modeling of design parameters for power, timing and SI analysis.

The event will include speakers from IBM, Texas Instruments, LSI, Mentor Graphics, STMicroelectronics, and Cadence. An abstract and link to the detailed agenda can be found here: http://www.dac.com/workshops+_+colocated+events.aspx?event=47&topic=3

Other Si2-sponsored events at DAC include the “OpenAccess Scripting Language Workshop” on June 6, from 1 p.m.-4:30 p.m. and the Annual Si2 Open Reception on June 6, from 4:30 p.m.-6:00 p.m. Both of these events are also free of charge and open to all.

Links to more specific agendas and registration information can be found here: http://www.si2.org/?page=11

About Si2

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 23rd year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents nearly 100 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org



Contact:

Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304




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