NXP Unveils UCODE I2C RFID Chip

EINDHOVEN, NETHERLANDS and SAN JOSE, CA -- (MARKET WIRE) -- Apr 05, 2011 -- NXP Semiconductors N.V. (NASDAQ: NXPI), the market leader in RFID solutions, today unveiled its groundbreaking UCODE I2C chip, which features an integrated I2C interface and a large 3,328-bit user memory. The UCODE I2C IC brings the power of Gen2 UHF to embedded systems, enabling bidirectional communication between a wireless reader and a microprocessor via an I2C bus. Using UCODE I2C, electronic devices can be configured and customized remotely, enabling wireless data exchange and product provisioning even while the device is powered down. NXP will showcase UCODE I2C at RFID Journal LIVE! next week in Orlando, Florida (booth 204).

"The UCODE I2C chip brings together our unparalleled expertise in both RFID and I2C. NXP invented the I2C bus over 30 years ago and is now the world's No. 1 supplier of I2C solutions, as well as the No. 1 supplier of RFID solutions," said Chris Feige, general manager, tagging and authentication product line, NXP Semiconductors. "With UCODE I2C, we're making it possible for manufacturers and retailers to offer a seamless customer experience when it comes to configuring, updating and servicing electronic devices -- wirelessly and remotely -- even when the device is powered down. The pervasiveness of the I2C bus across so many different types of peripherals also means that the UCODE I2C IC has the potential to enable and transform a whole new world of multi-applications."

Manufacturers, distributors and retailers of consumer electronic devices such as smartphones, tablets, music players and game systems can take advantage of UCODE I2C functionality in a number of different ways. As an anti-theft measure, a pallet of electronic devices moving through supply chain can remain disabled until they have been provisioned remotely through the I2C bus, and each device can be tracked through a unique tag ID (TID). When a consumer purchases an electronic device, the UCODE I2C chip enables the retailer to pre-configure and customize it without opening the box, pre-loading customer account information and eliminating the headache that customers typically face when setting up a new device. In addition, UCODE I2C makes it straightforward for manufacturers or retailers to remotely deliver minor upgrades or enable optional features purchased by the customer. In the event of any problems, UCODE I2C makes it possible to quickly identify the serial number as well as the error logs internal to the device without opening it, resulting in a significant reduction in the time it takes to resolve issues and repair the device as needed.

The UCODE I2C IC features a high memory capacity -- 3,328 bits of EEPROM memory -- which can be used to upload updates to the embedded microprocessor upon power up. The high-performance passive UHF interface includes two independent front-ends, each of which can be enabled or disabled independently, as well as an RF or I2C interface which can also be disabled independently.

Other target applications include RFID data loggers and sensors for products such as perishable foods and pharmaceuticals. By passing sensor information through the I2C bus, the UCODE I2C IC can track, monitor and record information such as temperature, humidity, pressure and shock as the products move through the supply chain. UCODE I2C could be used in other wireless sensor applications such as "smart shelves," by making it easy to monitor and manage electronic shelf displays by updating pricing and discounts dynamically through the I2C interface.

Technical Features
Key features of the NXP UCODE I2C IC include:

  • I2C interface for quick data transfer
  • Large 3,328-bit user memory offering 20-year data retention and 50,000 cycles of write endurance
  • Dual UHF front-end architecture, enabling antennas to support different read-range requirements.
  • Best-in-class RF sensitivity
  • Up to 160-bit EPC
  • 96-bit TID, including 48-bit serial number
  • EPCglobal 1.2.0 standard
  • Ability to use SDA pin of the I2C port as a digital switch
  • Switchable RF ports and I2C interface, depending on privacy needs
  • RF to I2C bridge mode for optimized data exchange (handshake)
  • SOT1193 package (1.6 x 1.6 mm, 0.5 mm thickness)

Availability
The UCODE I2C IC is currently sampling, with volume production scheduled later this year. Further information on UCODE I2C will be available at RFID Journal LIVE! next week in Orlando, Florida, and on the NXP UCODE product information page.

Links

  • NXP UCODE product information, including the UCODE I2C IC
  • Information on NXP I 2C solutions

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 30 countries, NXP posted revenue of $4.4 billion in 2010. For more information, visit www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and our financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, http:// www.nxp.com/investor or from the SEC website, http://www.sec.gov.

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