2011 speakers from Qualcomm, ARM, and Samsung Electronics America to highlight importance of semiconductors to consumer and mobile innovation
SANTA CLARA, Calif. — (BUSINESS WIRE) — January 11, 2011 — IBM, Samsung Electronics Co., Ltd., and GLOBALFOUNDRIES today announced the lineup of keynote speakers for the 2011 Common Platform Technology Forum. At the January 18 event, senior executives from ARM, Qualcomm, and Samsung Electronics America will offer their perspectives on the importance of innovation in semiconductor manufacturing to delivering the next generation of mobile devices and consumer electronics.
During the second general session from 10:30 – 11:45 a.m., conference attendees will have the opportunity to hear from the following industry leaders:
- Mike Mueller, Chief Technology Officer, ARM
- Steve Mollenkopf, Executive Vice President and Group President, Qualcomm
- David Steel, Executive Vice President of Strategic Planning & Corporate Communications, Samsung Electronics America
“We are honored to have such a distinguished lineup of keynote speakers at this year’s Common Platform Technology Forum,” said Chia Song Hwee, chief operating officer of GLOBALFOUNDRIES, on behalf of the Common Platform alliance. “These visionary leaders are at the forefront of innovation in the global technology industry, and they recognize the value of collaboration in delivering the next wave of consumer and mobile products to the market. We look forward to hearing their perspective on the changing dynamics of the semiconductor ecosystem.”
In addition to these industry keynotes, the event will feature presentations from senior executives with each of the Common Platform alliance companies. Representing the Common Platform alliance during a general session from 9:00 – 10:15 a.m. will be:
- Gary Patton, Vice President, IBM Semiconductor Research and Development Center
- Stephen Woo, President, System LSI Division, Samsung Electronics Co., Ltd.
- Chia Song Hwee, Chief Operating Officer, GLOBALFOUNDRIES
During the afternoon session, a variety of technical tracks will be offered on topics ranging from IP-technology co-optimization to 3D integration and advanced device architectures.
The 2011 Common Platform Technology Forum will be held Tuesday, January 18, 2011 at the Santa Clara Convention Center in California’s Silicon Valley. This free, daylong event will feature the Common Platform’s innovative collaboration to deliver semiconductor manufacturing solutions that address the challenges of the 32/28nm technology generation and beyond. A key part of the forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, mask, back-end and design services companies.
For more details and to register, please visit: http://www.commonplatform.com/tf2011/02/.
About the Common Platform
IBM, Samsung and GLOBALFOUNDRIES are members of the Common Platform alliance focusing on leading-edge, jointly developed digital CMOS process technologies and advanced manufacturing. The Common Platform model is further supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA, IP and design services industries. This ecosystem allows foundry customers to source their chip designs to multiple 300mm foundries with minimal design work, unprecedented flexibility and choice.