Leading research firm The Linley Group says CEVA is well positioned to capitalize on growing demand for DSP IP in rapidly expanding markets for connected devices and consumer electronics
MOUNTAIN VIEW, Calif.— December 6, 2010 — PRNewswire-FirstCall/--CEVA, Inc. (Nasdaq: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it has been ranked by leading research firm The Linley Group as the worldwide leader in DSP licensing revenue and in licensable DSP unit shipments in 2009, with 78% and 80% market share, respectively. The market share numbers were published in The Linley Group's recent report, titled 'Mobile and Wireless Semiconductor Market Share 2009' (1).
"CEVA is by far the most successful supplier of DSP IP, supplying DSPs to leading developers of chips for consumer electronics and communications," said Joseph Byrne, an analyst at The Linley Group and author of Mobile and Wireless Semiconductor Market Share 2009. "The company's strong customer base continues to gain significant market share at leading OEMs like Nokia and Samsung, further strengthening their leadership position in the licensable DSP arena. Furthermore, the serviceable market for merchant DSP IP in connected devices, portable and consumer electronics is rapidly expanding and CEVA is well positioned to capitalize on this."
"CEVA is pleased to be ranked by The Linley Group as the worldwide leader in DSP licensing revenue and licensable DSP unit shipments," said Gideon Wertheizer, CEO of CEVA. "Our clear leadership illustrates the strength of our DSP portfolio, and our ability to support our customers in the development of highly successful products based on our DSPs."
CEVA's industry-leading DSP cores power many of the world's leading semiconductors today for a broad range of applications, including cellular baseband, HD video, audio and voice-over-IP. Addressing next-generation 4G terminal and infrastructure markets, CEVA's latest generation CEVA-XC321 and CEVA-XC323 DSPs have been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance multimode 2G/3G/4G solutions. In-depth independent analysis of the CEVA-XC323 DSP was recently published in The Linley Group's Microprocessor Report (2). The report can be downloaded at http://www.ceva-dsp.com/mpr.
With seven of the world's top eight handset OEMs shipping CEVA-powered baseband processors today, CEVA's DSP technology now powers one out of every three handsets worldwide. CEVA's market presence is anticipated to continue to grow as the handset industry shifts more designs to CEVA-powered wireless semiconductor customers, including Broadcom, Infineon, Samsung, Spreadtrum, ST-Ericsson and VIA Telecom.
1) The Linley Group "Mobile and Wireless Semiconductor Market Share 2009" by Joseph Byrne, Linley Gwennap, and Jag Bolaria, June 2010.
2) The Linley Group "Microprocessor Report – CEVA Trains DSP Guns on TI", November 2010.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com