NXP GreenChip Technology Enables Breakthrough Quality in Non-Dimmable CFLs

EINDHOVEN, NETHERLANDS -- (MARKET WIRE) -- Nov 04, 2010 -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the release of the UBA2211, a new generation of non-dimmable CFL driver ICs for 230V and 110V fluorescent lamps based on GreenChip™ technology. The UBA2211 offers a fully integrated CFL driver along with a current controlled preheat function, enabling more compact fluorescent lamp designs, highly efficient power conversion, and extended CFL lifetimes in the range of 12,000 to 15,000 hours. In addition, NXP announced today the availability of the UBA2024B, also based on GreenChip technology, its first CFL driver with integrated switches tailored for the 110V market.

"As incandescent lamps are phased out around the world and with the recent EU ban on 75W incandescent bulbs in effect, the time is now for CFLs to prove they can offer better quality of light at lower costs. NXP driver ICs such as the UBA2211 offer breakthrough quality, performance and features that enable CFL manufacturers to match consumer expectations for quality lighting in the home," said Jacques le Berre, director of marketing and business development, Lighting Solutions, NXP Semiconductors. "As one of the first semiconductor companies to recognize the growing importance of energy-efficient lighting, NXP's commitment to transform the lighting industry is a natural extension of its High Performance Mixed Signal strategy. Working together with our customers, NXP is committed to proving that with GreenChip technology, fluorescent lamps can light up the hearts and minds of consumers around the globe."

Enabling High-Quality Non-Dimmable CFLs
The latest generation of NXP CFL driver ICs complies with the most demanding specifications for higher quality in non-dimmable CFLs, such as better light, longer lifetime, smaller form factor and faster ignition, thus helping to accelerate market adoption of fluorescent lamps. The adoption of integrated chip solutions to replace standard discrete implementations in electronic ballasts will enable manufacturers to address these stricter requirements and deliver more consumer-friendly CFLs with better quality light, faster warm-up, and ultimately longer product lifetimes for lower total cost of ownership.

The UBA2211 family of integrated circuits are a range of high-voltage monolithic ICs for driving CFL in half-bridge configurations. The family is specifically designed to provide easy integration of lamp loads across a range of burner power and mains voltages. The UBA2211 integrates the adjustable current controlled preheat mode technology, a key requirement in the EU directive, which enables the preheat time to be set and facilitates in achieving extended lifetime of the CFLs. With its exceptionally small form factor, the UBA2211 significantly reduces the Bill of Materials (BOM) for manufacturers, thereby enabling volume production of high quality CFLs.

The UBA2211 family includes:

  • UBA2211: generic controller for 230V / 110V markets driving external power switches
  • UBA2211A: 230V for CFL lamp power up to 11W
  • UBA2211B: 230V for CFL lamp power up to 18W
  • UBA2211C: 230V for CFL lamp power up to 23W

GreenChip-Enabled Products
GreenChip technology lies at the heart of NXP's cost-effective, high-efficiency power management and lighting ICs. NXP GreenChip products are suitable for any device that draws AC power and plugs into the wall. GreenChip offers many benefits instrumental in designing energy-efficient products, ranging from minimal switching losses to low-power standby. GreenChip technology is based on NXP's EZ-HV process which enables cost-effective high-voltage silicon-on-insulator (HV-SOI) ICs. Using a unique thin silicon approach to HV-SOI construction, the process allows GreenChip ICs to combine high-voltage circuits that handle rectified AC line supply voltages with low-voltage CMOS logic for on-chip intelligence.

New solutions for the 110V market
NXP also announced the availability of UBA2024B, its first CFL driver with integrated switches tailored for the 110V market. With this new driver IC, NXP has now extended its UBA2024 product family to address all CFL driver markets with six types of driver ICs. Pin-to-pin compatible with the UBA2024 family, the UBA2024B saves space, increases efficiency and extends burner lifetime.

Key features of CFL lighting based on GreenChip technology include:

  • Fast start-up with quick start for faster light output run-up
  • Better energy efficiency with an average 5 percent higher efficiency
  • Longer lifetime preheat feature that preserves the life of the lamp burner; while standard lamps based on discrete components reach an average 4,000 to 6,000 hours, NXP IC based lamps demonstrate lifetime performance in the range of 12,000 to 15,000 hours

NXP IC-based lighting solutions are fully supported by dedicated teams and tools. Design engineers benefit from seamless integration of CFL drivers into incandescent lamp form factors for easy migration to IC-based lighting solutions.


About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. Headquartered in Europe, the company has approximately 28,000 employees working in more than 25 countries and posted sales of USD 3.8 billion in 2009. For more information, visit www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward- looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to rectify them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and financial condition, and the market price of the notes, could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made; and, except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our filings are available from our Investor Relations department or from the SEC website, www.sec.gov.

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