KGD Packaging and Test Workshop Will Focus on Finer Geometries, Oct. 28-29

SAN JOSE, California – AUSTIN, Texas – August 26, 2010 – The 17th Annual International KGD (Known Good Die) Packaging and Test Workshop 2010 will focus on semiconductor die products test, assembly, manufacturing, and business issues in the microelectronics industry. Co-organized by SEMI and TechSearch International, the workshop’s theme this year is “Challenging Issues for KGD as the Industry Moves to Finer Geometries.” The event is set for October 28-29 in Austin, Texas.

Keynote presenter Dr. Bill Bottoms, chairman and CEO of Third Millennium Test Solutions and chairman of the ITRS Roadmap Committee, will present on “Known Good Die in the Era of Deep Submicron and 3D Integration.” Workshop presenters represent companies including: Aehr Test Systems, Analog Devices, ASE Group, Galaxy Semiconductor, Infineon, Muhlbauer, Nanya Technology, PARC, Pintail Technologies, Ridgetop, Rudolph Technologies, SavanSys Solutions, Schweizer Electronics, Semilab, STATS ChipPAC, and 3M. A special panel will explore a related topic of “Is KGD Required for TSV?” moderated by Jan Vardaman of TechSearch International.

KGD Workshop sessions include:

  • “Small Problems — Big Solutions”: with presentations on Junction Leakage Degradation; Fine Pitch Copper Wire Bonding Implementation Down to Deep Submicron; and Scalable Microspring Contacts for Integrated Test and Packaging
  • Process Improvements: Test Process Control—- Real-Time, Automated Methods to Improve Yield and Lower Cost; Introduction to Protocol-Aware ATE; and Cost vs. Reliability Tradeoff for Stacked Devices
  • KGD for Embedded Solutions: KGD Cost Modeling for Embedded Products; Chip Embedding into PCB Substrates Without KGD; KGD for Embedded Products; and LED Test and Packaging Challenges: A User Perspective
  • Wafer Sort and Handling Improvements: Wafer Sort Methods Employed to Achieve Automotive Customer’s Zero ppm Requirements; New Advancements in Ultra-Thin Die Handling and Flip Chip Inspection; and Rapid Deployment of IC Solutions

“Over the years, this workshop has given participants the opportunity to shape the evolution of bare die in packaging. While the early focus was on specialized high-performance systems, now the focus shifts to low-cost solutions that enable the increasing smaller devices in the portable world. Attendees can debate key issues with industry peers and experts in the field.” stated Jonathan Davis, president of the Semiconductor Business Unit at SEMI.

The workshop brings together technical experts, managers and business development professionals from around the world for an interactive exchange of information on the latest developments in the die product industry.

For more information on the KGD Packaging and Test Workshop, please visit: .

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit .

About TechSearch International, Inc.

TechSearch International, Inc. was founded in Austin, Texas, in 1987 by E. Jan Vardaman as a technology licensing and consulting firm specializing in the electronics industry. The firm is recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology. The company’s goal is to enable our clients to compete more effectively by providing accurate, relevant, and timely information on technology trends and market developments. For more information, visit


Deborah Geiger/SEMI
Ph: 408.943.7988

E. Jan Vardaman/TechSearch International, Inc.
Ph: 512.372.8887

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