Rambus to Demonstrate Mobile XDR™ and DDR3 Memory Solutions at Denali's MemCon 2010

SANTA CLARA, Calif. — (BUSINESS WIRE) — July 28, 2010 — Rambus Inc. (NASDAQ: RMBS):

Who:

   

Rambus Inc. (NASDAQ: RMBS)

 

Where:

Denali MemCon 2010
Hyatt Regency Santa Clara
Convention Center Ballrooms A-H
Santa Clara, California
 

When:

July 28, 2010

Join Rambus Inc., one of the world’s premier technology licensing companies, at MemCon 2010, for presentations and demonstrations of its innovations including:

Rambus Demos:

  • Mobile XDR™ Architecture: The fastest and most power-efficient memory for mobile applications. Capable of achieving data rates of 3.2 to 4.3 gigabits per second (Gbps) at an unprecedented power efficiency of 2.2 milliwatts per gigabit per second (mW/Gbps), Mobile XDR memory is ideal for next-generation smartphones, netbooks, and mobile gaming and multimedia products.
  • DDR3 PHY for consumer electronics: The world’s first high-performance DDR3 interface solution implemented in a low-cost wire bond package performing memory transactions to and from a DDR3 SDRAM device operating at 1866 megatransfers per second (MT/s) with architectural support for data rates of up to 2133MT/s.

Rambus Presentations:

Wednesday, July 28, 3:30 p.m. PT

“Challenges and Solutions for GHz DDR3 Memory Interface Design”

Presented by Arun Vaidyanath, Senior Engineer at Rambus

During this session, Arun Vaidyanath will discuss the technical challenges engineers face when designing and integrating DDR3 memory controller interfaces operating beyond 1GHz in high-volume, low-cost packages for consumer electronics. The session will address methods for maintaining signal integrity at high speed even in wire bond implementations.

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