Research and Markets: Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in Substrate - The Next Generation of IC Packaging & Substrate Assembly Waves


  • Integrated semiconductor Device Manufacturers and fabless semiconductor companies
  • - Benchmark the industrialization status of embedded packaging technologies within the industry
  • - Identify possible partnership /or second source packaging subcontractors for your forthcoming developments
  • Assembly and Test Service companies
  • - Get the list of the main companies interested in Embedded WLP
  • - Screen possible new applications and technologies to support diversification strategy with embedded packaging platform
  • Equipment and Material suppliers
  • - Understand the differentiated value of your products and technologies in this emerging but fast growing market
  • - Identify new business opportunities and prospects
  • Electronic module makers and Original Equipment Makers
  • - Evaluate the availability and benefits of using embedded package components in your end system
  • - Monitor different embedded WLP suppliers to adjust your sourcing strategy
  • PCB and IC substrate manufacturers
  • - Monitor the evolution of IC packaging, assembly and test, especially linked to the emerging chip embedding PCB-based technologies, FO-WLP, IPD and 3D interposers

Key Topics Covered:

Scope of the Report & Definitions Executive Summary 1 - Embedded die Packaging of active ICs and passive components

  • Motivations and Drivers
  • Applications & End-markets:
  • Status of commercialization
  • - Cell-phone & Consumer applications
  • - Automotive applications
  • - Medical applications
  • 2009-2015 market forecasts for Embedded die packages
  • - In Package shipments (Munits)
  • - In Packaging revenues ($M)
  • Supply chain emerging for embedded die packages
  • - Players and positioning in the electronic value chain
  • - Who is the most aggressive in the commercialization?
  • - Who is doing what: partnership identified
  • Technology flavors for embedded package
  • - Chip first versus chip last?
  • - Single die embedding versus SiP module?
  • - Challenges related to yield & supply chain
  • Equt & Material Tool-Box for Embedded die
  • Cost structure for Embedded packages manufacturing
  • - Comparison with competitive package alternative that Embedded die technology is looking for direct replacement (QFN, BGA, WLCSP, SOT, PoP)
  • - Cost structure target of Embedded die for different application case (RFID, IPD, Power MOSFET / IGBT, DC/DC converters, PMU, Wireless Connectivity ICs, Digital Baseband, Memories, etc )
  • Conclusion on sweets spots for the introduction of Embedded die technology in the short / medium / long term
  • - Global Roadmap for Embedded die

2 - Fan-Out WLP package technology development

  • Motivations and market drivers
  • - Thermal performance of FOWLP package compared to FC-BGA package solution
  • Applications & status of commercialization
  • 2009-2015 market forecasts for FOWLP type of packages
  • - In Package shipments (Munits)
  • - In Packaging revenues ($M)
  • Supply chain emerging for FOWLP
  • - Players and positioning in the electronic value chain
  • - Who is the most aggressive in the commercialization?
  • - Who is doing what: partnership identified
  • FOWLP technologies & challenges
  • - Who owns the IP in this space?
  • - 1st generation versus 2nd generation FOWLP TMV Through Mold Via fabrication
  • - Panel size manufacturing for future FO-WLP
  • - Passive integration with FO-WLP technologies
  • Equipment & Materials for FO-WLP
  • - Challenges in new materials selection and missing equipments
  • Cost structure for FO-WLP manufacturing
  • - Competitive package alternative that FOWLP technology is looking for direct replacement (FC-CSP, FC-BGA, PoP, etc)
  • - Cost structure for FOWLP by application (RFEM module, PoP digital module, PMU chip, wireless baseband SOC chip, etc)
  • Conclusion on sweets spots for introduction of FOWLP technology in short / medium long term
  • - Global Roadmap for Fan-Out WLP

Review Article Be the first to review this article

ClioSoft at DAC

Featured Video
Senior Electrical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Upcoming Events
DAC 2018 at Moscone Center West San Francisco CA - Jun 24 - 28, 2018
Symposium on Counterfeit Parts and Materials 2018 at College Park Marriott Hotel & Conference Center MD - Jun 26 - 28, 2018
Concar Expo 2018 at Convention Hall II Sonnenallee 225 Berlin Germany - Jun 27 - 28, 2018
Nanotech 2019 at Tokyo Big Sight East Halls 4-6 & Conference Tower Tokyo Japan - Jun 30 - 1, 2018
ClioSoft at DAC
TrueCircuits: IoTPLL

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise