Barcelona, Spain — February 26, 2010 — /
PRNewswire-FirstCall/ -- Mobile World Congress -- CEVA, Inc. (Nasdaq: CEVA) (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Samsung Electronics Co., Ltd., has deployed CEVA DSP core technology in their first generation commercial Long Term Evolution (LTE) modem. The Kalmia modem chipset supports download speed up to 100Mbps and upload speed of 50Mbps within the 20MHz frequency bandwidth. Samsung recently introduced the first LTE dongle utilizing the modem and is now commercially available in Stockholm, Sweden and Oslo, Norway.
"Our first commercially available LTE modem brings outstanding dataspeeds and performance to a broad range of portable devices including netbooks, eReaders, MIDs and more," said Kyung-Ho Kim, Vice President of Samsung. "By leveraging CEVA's DSP technology in our LTE modem design, we ensure ultra-low power consumption, critical to the successful adoption of LTE in these battery-powered devices."
"Samsung is the driving force behind the realization of a true 4G mobile broadband experience and we are proud to partner with them for their LTE product line," said Gideon Wertheizer, CEO of CEVA. "Their selection of our DSP core technology further substantiates our position as the world's leading provider of DSP technology to the wireless industry."
CEVA's industry-leading DSP cores power many of the world's leading cellular baseband handset solutions. The company's broad customer base includes Infineon, ST-Ericsson, Broadcom, Samsung, Mediatek, Spreadtrum and VIA Telecom, among others. To date, more than 600 million CEVA-powered handsets have shipped. Addressing next-generation 4G terminal and infrastructure markets, CEVA DSPs have been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance 4G/LTE/WiMAX solutions. CEVA has multiple licensees developing LTE handset and infrastructure solutions based on CEVA DSP cores.
About CEVA, Inc.
CEVA is the leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, including handsets from all top five handset OEMs – Nokia, Samsung, LG, Motorola and Sony Ericsson. Today, more than one in every four handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com