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Samsung Signs Multi-Year License for Tensilica's HiFi 2 Audio DSP
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    SANTA CLARA, CA -- (MARKET WIRE) -- Nov 19, 2009 -- Tensilica,® Inc. today announced that the Digital Media & Communications Business of Samsung Electronics has signed a multi-year license to Tensilica's HiFi 2 Audio DSP (digital signal processor) for use in Samsung's multimedia system products after a successful previous deployment in Samsung's System LSI Division. Tensilica's HiFi architecture is the most popular commercial audio core for system-on-chip (SOC) designs.

    "We selected the Tensilica HiFi Audio DSP because of its impressive performance capabilities and because of the breadth of software codecs available," stated K.W. Chun, vice president, Digital Media & Communications Business of Samsung Electronics. "The HiFi 2 Audio DSP can execute the most demanding multi-channel audio algorithms at remarkably low MHz and low power."

    "We are pleased that another major division of Samsung Electronics has selected our HiFi 2 Audio DSP for their next-generation home entertainment products," stated Jack Guedj, Tensilica's president and CEO.

    About Tensilica

    Tensilica, Inc. is the recognized leader in customizable dataplane processors. Dataplane Processor Units (DPUs) consist of performance intensive DSP (audio, video, imaging, and baseband signal processing) and embedded RISC processing functions (security, networking, and deeply embedded control). The automated design tools behind all of Tensilica's application specific processor cores enable rapid customization to meet specific data-plane performance targets. Tensilica's DSPs and processors power top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica's patented benchmark-proven DPUs visit www.tensilica.com.

    Editors' Notes:

    --  Tensilica and Xtensa are registered trademarks belonging to Tensilica
        Inc. All other company and product names are trademarks and/or registered
        trademarks of their respective owners.
    --  Tensilica's announced licensees include: ADDMM, Afa Technologies,
        ALPS, Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay
        Microsystems, Berkeley Wireless Research Center, Brocade, Broadcom, Cisco
        Systems, CMC Microsystems, Conexant Systems, Design Art Networks, DS2, EE
        Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Hudson Soft,
        iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG
        Electronics, Lucid Information Technology, Marvell, NEC Laboratories
        America, NEC Corporation, NetEffect, Neterion, Nethra Imaging, Nippon
        Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical Co. Ltd.,
        Panasonic Mobile, Penstar, Plato Networks, PnpNetwork Technologies,
        PowerLayer Microsystems, Samsung, SiBEAM, Silicon Optix, Sony,
        STMicroelectronics, Stretch, TranSwitch Corporation, Triductor Technology,
        u-Nav Microelectronics, UpZide, Valens Semiconductor, Validity Sensors,
        Victor Company of Japan (JVC), WiLinx, WiQuest Communications, and XM
        Radio.
        

    Press Contacts:
    
    Paula Jones
    (408) 327-7343
    
    Email Contact
    
    Erika Powelson
    (831) 424-1811
    
    Email Contact
    
    




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