Design Kits Significantly Simplify ASIC Design
SANTA CLARA, Calif. — (BUSINESS WIRE) — September 28, 2009 — eASIC Corporation, a provider of NEW ASIC devices, today announced the immediate availability of two ASIC-in-a-Box design kits that enable ASIC design to be widely accessible and thereby reverse the trend of declining ASIC design starts. Through simplifying the design flow, the design kits empower engineers who are unfamiliar with ASIC design to now complete designs at a fraction of the cost and time compared to traditional standard cell ASICs.
Nextreme NEW ASICs are uniquely constructed to help simplify design, verification and silicon processing steps within the overall flow. Designers are able to focus their effort mainly on achieving their desired functionality and timing and not on arduous complex tasks such as power mesh design, signal integrity, test insertion, clock insertion, STA, ATPG, formal verification and LVS/DRC as they do with traditional standard cell ASICs. The NEW ASIC-in-a-Box design kits provide software and documentation for completing and implementing Nextreme chip designs, and also deliver board design and debug guidelines for designing systems that incorporate Nextreme devices.
“Our NEW ASIC-in-a-Box design kits dispel the myth that ASICs are difficult, risky and expensive to design,” commented Jasbinder Bhoot, Vice President of Marketing at eASIC Corporation. “eASIC has completed over 100 tape outs and delivered over 100 prototype designs in less than two years using the flow and tools that are now available in the ASIC-in-Box kits. Our new design kits make ASIC design affordable, accessible and achievable for everyone.”
Design Kit Contents
The NEW ASIC-in-a-Box Design Kits contain the following items:
Designers can choose from one of two design kits depending on their preferred choice for handoff deliverables. For more information on the Nextreme NEW ASIC-in-a-Box Design Kits, or to request a free 30-day evaluation, visit www.easic.com.
Availability and Pricing
The Nextreme NEW ASIC-in-a-Box Design Kits are available now. Pricing is available from eASIC sales representatives.
eASIC is a fabless semiconductor company offering breakthrough NEW ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information on eASIC please visit www.eASIC.com
Narinder Lall, 408-855-9200