Toshiba Adds Low On-State Resistance MOSFETs In Compact, High-Current 3.3mm x 3.3mm TSON Package

20V and 30V MOSFETs for Load Management and Battery Protection Control Modules for Notebook PCs Achieve High Power Dissipation in Small, Thin 3.3mm x 3.3mm Package

IRVINE, Calif., Aug. 26 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, announced the availability of Toshiba's TSON Advance MOSFET package that offers high power dissipation in a thin, compact, 3.3mm x 3.3mm x 0.9mm package. Compared to the widely used 5.0mm x 6.0mm SOP-8 package, the TSON Advance package developed by Toshiba Corp. (Toshiba) reduces mount area requirements by 64 percent, while achieving the same power dissipation of 1.9W.

TAEC also announced four low R(DS)(ON) power MOSFETs in this new TSON Advance package, targeted for use in power management switch or battery protection control circuits (PCM) for notebook PCs and electronics. The compact package enables high density mounting with high current capability.

A 30V N-channel device, TPCC8008, and a 20V N-channel device, TPCC8007, are included in the initial lineup, along with two 30V P-channel devices, TPCC8102 and TPCC8103. For specifications and R(DS)(ON), please see table below.

"The small, highly compact TSON Advance package helps reduce board space requirements while achieving high power density comparable to the larger SOP-8, " said Jeff Lo, business development manager, Discrete Power Devices, for TAEC. "As a result of this robust packaging technology, the new MOSFETs offer designers options to increase board density or reduce the overall board size."

    Technical Specifications

    Product                    Maximum Rating
    Number    Polarity       V(DSS)(V)   I(D)(A)

    TPCC8007  N-Channel         20         27
    TPCC8008  N-Channel         30         25
    TPCC8102  P-Channel        -30        -15
    TPCC8103  P-Channel        -30        -18

    Product                    R(DS)(ON) (milliohms)                  Process
    Number         Typ.          Max.          Typ.          Max.

    TPCC8007       6.2           8.7           3.5           4.6      UMOS IV
              V(GS) = 2.5V  V(GS) = 2.5V  V(GS) = 4.5V  V(GS) = 4.5V

    TPCC8008       8.5            13           4.5           6.8      UMOS IV
              V(GS) = 4.5V  V(GS) = 4.5V  V(GS) = 10V   V(GS) = 10V

    TPCC8102      25.5          33.2          14.5          18.9      UMOS V
              V(GS)=-4.0V   V(GS)=-4.0V   V(GS)=-10V    V(GS)=-10V

    TPCC8103       17             25           9.4            12      UMOS V
              V(GS)=-4.0V   V(GS)=-4.0V   V(GS)=-10V    V(GS)=-10V

Pricing and Availability

Samples of the new Toshiba UMOS IV and V MOSFETs in TSON packages are available now, with mass production beginning to ramp for TPCC8008, TPCC8102 and TPCC8103. Mass production for TPCC8007 will begin in October 2009. Prices in sample quantities start at $0.30.

Toshiba's Discrete Products

Since 1986, Toshiba Corp. has ranked as the top discrete supplier on a worldwide basis, based on annual revenue from international shipments of total discrete products. According to the most recent annual report from market research firm Gartner Dataquest (San Jose, CA), Toshiba remained the top discrete semiconductor supplier. (Source: "2008 Worldwide Semiconductor Market Share Report," Gartner, April 2009). More specifically, Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers, LMOS logic, CMOS logic, photocouplers, TOSLINKs, LEDs, small signal diodes and transistors. The company's discrete devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, while emphasizing its strength in the automotive and industrial markets.

*About TAEC and Toshiba Corp.

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2008 WW Semiconductor Revenue, April 2009). For additional company and product information, please visit

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at, or from your TAEC representative.

SOURCE Toshiba America Electronic Components, Inc.

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