The FDMC8200 addresses key design challenges of DC-DC applications, space conservation and thermal performance, through its advanced packaging technology and proprietary PowerTrench 7 process. The compact and thermally-enhanced 3mm x 3mm Power33 MLP package, and PowerTrench 7 technology, inherently offers high power density, high power efficiency and excellent thermal performance.
This dual MOSFET is part of a comprehensive portfolio of advanced MOSFET technology that provides a wide range of breakdown voltages and state of the art packaging technology for efficient power management and low thermal resistance. This portfolio includes the FDMS9600S and FDMS9620S, integrated FET modules that also significantly reduce board space and enable synchronous buck designs to achieve higher conversion efficiency.
Price (each, 1000 pcs.): US$ 0.50
Availability: Samples available now
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About Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) is a global leader delivering energy-efficient power analog and power discrete solutions. Fairchild is The Power Franchise®, providing leading-edge silicon and packaging technologies, manufacturing strength and system expertise for consumer, communications, industrial, mobile, computing and automotive systems. An application-driven, solution-based semiconductor supplier, Fairchild provides online design tools and design centers worldwide as part of its comprehensive Global Power ResourceSM. Please contact us on the web at www.fairchildsemi.com.
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