Autosar and VSA from Mentor Graphics

SpringSoft and TSMC Commence Joint Development of Multi-Node Process Design Kit Portfolio SpringSoft announced a multi-year technology agreement with TSMC to jointly develop and validate process design kits (PDKs) for leading-edge chip manufacturing technologies. The collaboration between the two companies is driven by customer demand for SpringSoft PDKs and their mutual support of interoperable PDKs as the long-term goal for providing custom chip designers with the ultimate in manufacturing flexibility, technology choice, and design productivity.

Other EDA News

Intercept Moves Ahead In High-Speed Design Market with Xtent Technology Rules Editor
Verific Design Automation Tools Deliver Industry-Leading RTL Language Support for Xilinx ISE Design …
Achronix Selects Synopsys as Its Leading EDA Partner
Cadence and Xilinx Simplify SoC Development With Enterprise Verification Capabilities for FPGA …
Mentor Graphics Announces Logic and Physical Synthesis Support for Xilinx Virtex-6 and Spartan-6 …
SMIC and Synopsys Announce the Availability of Reference Flow 4.0
Solido Design Launches New Process Variation Solution to Solve Well Proximity Effect Problems for …
UMC Qualifies Comprehensive Mentor Graphics Silicon Test Suite for its 65nm and 40nm IC Reference …
Synopsys and TSMC Deliver Accurate Lithography Verification for 28nm Designs
SMIC and Synopsys Announce the Availability of Reference Flow 4.0
Virage Logic’s AEON® Becomes the First Multi-Time Programmable Embedded Non-Volatile Memory …
Sonics Combines DRAM Scheduler with Synopsys Protocol Controller For Integrated High-Performance …
Industry's Fastest Growing Standard for DDR-PHY Interface Specification Expands With LP-DDR2 and …
1st Asia Symposium on Quality Electronic Design Announces Final Program; July 15 & 16 in Kuala …
Dassault Systemes Launches V6R2010
Calypto Delivers Industry’s First Automated Tool for Memory Power Optimization
VXL Technologies joins IPGenius Cores Programme
SpringSoft and TSMC Commence Joint Development of Multi-Node Process Design Kit Portfolio
Coventor and Cadence Collaborate to Develop a MEMS + IC Design Suite
CoWare, EVE to Host Webinar on “Linking Virtual Platforms and Emulation for Early Software …
Tensilica Announces Strategic Investment by DOCOMO Capital
Tensilica Announces High-Performance ConnX Baseband Engine for LTE and 4G Wireless DSP Handsets and …
Tensilica Announces New High-Performance ConnX Communications DSP Family for LTE and 4G SOC Designs
Silicon Image Introduces First Products Incorporating HDMI 1.4 Features for DTV and Home Theatre …
46th Design Automation Conference Offers Six Full-Day Tutorials
Magma's Vivek Raghavan Named Managing Director of India Operations
Open Virtual Platform (OVP) Initiative for Multi-Core Software Development Celebrates One Year …
Synfora Wins Electronique’s Golden Electron Award for EDA Software
CoWare, EVE Link Electronic System Virtualization, Emulation for ARM AXI-based Systems
Real Intent Welcomes Pranav Ashar Back as CTO
Mentor Graphics Signs EDA Direct as New Distributor
Ricoh Delivers Commercial Printing Products Using Forte’s Cynthesizer
Synopsys and Actel Renew OEM Relationship for FPGA Design Software
CebaTech Hires Joe Rash as Vice President of Business Development and Marketing
University of Washington Team Achieves 100X Acceleration of Tomographic Image Reconstruction Moving …
IEEE Council on EDA to Host NSF Director at DAC Luncheon
ANSYS Releases SIwave 4.0
Kaben Wireless Silicon Achieves up to 7X Performance Boost With Cadence Virtuoso Accelerated …
Taiwan's Industrial Technology Research Institute Achieves Digital Video Tuner Tapeout Success With …
Synopsys Continues Galaxy Custom Designer Momentum with 2009.06 Release

Other Embedded, IP & SoC News

Webinar Alert: Prototyping & Functional Verification for Radiation-Tolerant Space-Flight …
Easy regulation compliance and improved energy efficiency made possible with TI's new low-cost …
Zarlink Introduces New ZLynx Active Optical Cable for High-Speed Data Center Interconnect
Cypress Solutions Library Now Offers Over 150 Design Elements
Xilinx Accelerates Development of Next-Generation Systems With Industry's First Deployment of …
Marvell Introduces Plug Computing to Europe
Rambus to Present New Innovations and Demonstrate High-Speed Memory Technologies at Denali MemCon
HDL Design House announces high performance AHB SPI flash memory controller (HIP 3100)
1st Asia Symposium on Quality Electronic Design Announces Final Program
Ramtron 4-Megabit F-RAM Selected for Highly Reliable Industrial Solid-State Disk
RMI Announces Support for Wind River’s JTAG Development Tools for Multi-Core Multi-Threaded …
Altair Semiconductor Announces LTE Baseband Processor - FourGee(TM)-3100
Femtocell equipment manufacturers can quickly develop residential and enterprise products with TI's …
Gigle Semiconductor Launches World's First Gigabit Home Networking Chip, Fuels Latest Belkin …
Texas Instruments collaborates with Continuous Computing and mimoOn for HSPA and LTE femtocells
Actel Chips Away at Poor WAN Performance With Silver Peak Systems
ANADIGICS' Broad Portfolio of 3G PAs Power LG Electronics' New ARENA Handsets
Tilera Announces Production Availability of the TILEPro Family of Processors
Rambus Demonstrates Superior Power Efficiency of World’s Fastest Memory
Wi-Fi Experts Devicescape and Intel Discuss Consumer Demands Around Next Generation Wi-Fi-Enabled …
ZeroG Wireless Announces Greg Winner as New CEO
Rambus Updates Second Quarter Guidance
Perfectus Announces Industry’s First SystemVerilog-based OVM Tested ONFi Verification IP for ONFi …
STMicroelectronics Delivers STM32 Connectivity Line Microcontrollers with Ethernet, USB OTG, …
Atmel Introduces AVR32 Microcontroller Which Lowers Industry's Best Power Consumption by 63%
TI introduces industry's first 18-bit system-on-chip up to 1 MSPS for high-speed data acquisition
SEMATECH Announces Speaker Lineup for SEMICON West 2009
ARM Provides Technology for LG Electronics Digital TVs
Freescale Introduces ‘ultimate Ethernet Connectivity Solution’ for Industrial Applications
National Semiconductor Launches SolarMagic Power Optimizers in Japan
Renowned Memory Expert Joins Innovative Silicon
IEEE Broadband Over Power Lines Working Group Approves Provisions for MAC/PHY and Inter-System …
Broadcom Extends Tender Offer for Emulex to July 1, 2009
Texas Instruments introduces industry's smallest integrated load switch

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