SMSC Introduces Industry’s First High-Speed USB Interconnect Device (HSIC) for Embedded Applications

Our forward looking statements are qualified in their entirety by the inherent risks and uncertainties surrounding future expectations and may not reflect the potential impact of any future acquisitions, mergers or divestitures. All forward-looking statements speak only as of the date hereof and are based upon the information available to SMSC at this time. Such statements are subject to change, and the Company does not undertake to update such statements, except to the extent required under applicable law and regulation. These and other risks and uncertainties, including potential liability resulting from pending or future litigation, are detailed from time to time in the Company's reports filed with the SEC. Investors are advised to read the Company's Annual Report on Form 10-K and quarterly reports on Form 10-Q filed with the Securities and Exchange Commission, particularly those sections entitled “Other Factors That May Affect Future Operating Results” or “Risk Factors” for a more complete discussion of these and other risks and uncertainties.

SMSC and MOST are registered trademarks of Standard Microsystems Corporation. Product names and company names are trademarks of their respective holders.



Contact:

Corporate Communications:
SMSC
Carolynne Borders, Voice: 631-435-6626
Director of Corporate Communications
Fax: 631-273-5550
Email Contact
OR
Media:
McClenahan Bruer Communications
Barry Katcher, Voice: 503-546-1003
Public Relations
Fax: 503-546-1001
Email Contact



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