STMicroelectronics Reports 2008 Third Quarter and Nine-Month Revenues and Earnings (Revenue up 11%)



    --  In non-volatile memory, ST introduced 1MHz two-wire serial EEPROMs in
        256-Kbit, 512-Kbit and 1-Mbit densities, allowing data rates up to
        2.5-times faster than the I2C Fast-mode.



    --  In MEMS motion sensors, ST gained design wins for its three-axis
        accelerometers with several mobile phone makers in China and a major
        Asian player. The Company also gained significant business from a
        worldwide leader in the portable MP3 player market and also won a
        significant contract with another of the major players in the gaming
        market -- ST already supplies MEMS accelerometers for the Nintendo Wii.
        Additionally, ST's complete free-fall detection solution, which consists
        of a 3-axis motion sensor and software, was chosen to protect user data
        stored on HDDs in the new ESPRIMO Mobile family of professional
        notebooks from Fujitsu Siemens Computers.



    --  Also in MEMS, ST launched an ultra-compact gyroscope that provides a
        choice of analog or digital absolute angular-rate outputs, and measures
        fast angular displacements in applications such as intuitive man-machine
        interfaces or enhanced-GPS for car navigation.



    --  In power conversion, ST introduced a new Pulse Width Modulation
        controller, the first integrated device optimized for soft-switching
        asymmetrical half-bridge converters. The company also gained a design
        win from a major player in the PC market for two voltage-regulator
        modules for the CPU power supply in a desktop reference design; in
        addition to another design win for a new powerline communication
        transceiver with a manufacturer in China for a sub-metering application.
        ST is also ramping up production of: a new power management controller,
        for a major Taiwanese motherboard OEM; and a DC/DC switching regulator,
        for a major Japanese brand digital-still-camera.



    --  Also in power conversion, ST introduced into the market a new 10-12A
        overvoltage-protected AC switch series, aimed at helping white goods
        meet the latest energy and safety standards. ST also enlarged its
        high-junction-temperature TRIAC family with a new sensitive series
        dedicated to small appliances and industrial systems.



    --  In power MOSFETs, ST introduced a 250A power MOSFET with the lowest
        on-resistance in the market and a new family of devices based on the
        company's innovative SuperMESH3 technology to increase the ruggedness,
        switching performance and efficiency of lighting ballasts and
        switch-mode power-supply applications. ST gained multiple design wins
        for its MOSFETs, primarily in lighting and power-supply applications,
        including one with a leading PC motherboard maker. In power bipolar
        devices, ST's low-voltage bipolars were qualified for use by a major
        smart-metering-system customer. And in linear and interface devices, ST
        gained design wins in various markets, including automotive and audio



    --  In advanced analog and logic ICs, ST announced a highly integrated RGB
        LED driver and gained design wins for its logic ICs with major notebook
        PC makers in China and Japan, and with a leading Japanese LCD TV maker.



    --  In analog and mixed-signal ICs, ST announced a new series of
        clock-distribution ICs and also sampled clock-distribution ICs to two
        major Asian mobile-phone customers. Additionally, reset and temperature
        sensors were designed-in at a major HDD maker and a real-time clock IC
        was designed-in at a major GPS manufacturer.





Technology Highlights


    --  ST, Infineon Technologies and STATS ChipPAC announced an agreement to
        jointly develop the next-generation of embedded Wafer-Level Ball Grid
        Array (eWLB) technology for use in manufacturing future-generation
        semiconductor packages.



    --  ST and the Waseda University Humanoid Robotics Institute (HRI) announced
        the development of a high-performance, two-wheel inverted-pendulum
        robot, called WV-1, which is the first result of an ongoing cooperation
        for the research and development of technology and solutions for
        innovative humanoid robots and medical-care robot systems.




All of STMicroelectronics' press releases (including all releases in Q3) are available at


SuperMESH and SoundTerminal are trademarks of STMicroelectronics. All other trademarks or registered trademarks are the property of their respective owners.



Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) based on management's current views and assumptions and involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those in such statements due to, among other factors:


    --  further deterioration on the worldwide financial markets, economic
        recession in one or more of the world's major economies and the effect
        on demand for semiconductor products in the key application markets and
        from key customers served by our products , which in turn makes it
        extremely difficult to accurately forecast and plan future business
    --  our ability to adequately utilize and operate our manufacturing
        facilities at sufficient levels to cover fixed operating costs
        particularly at a time of decreasing demand for our products due to
        decline in demand for semiconductor products;
    --  pricing pressures which are highly variable and difficult to predict;
    --  the results of actions by our competitors, including new product
        offerings and our ability to react thereto;
    --  the financial impact of obsolete or excess inventories if actual demand
          differs  from  our  anticipations;
        --    the  impact  of  intellectual-property  claims  by  our  competitors  or  other
                third  parties,  and  our  ability  to  obtain  required  licenses  on  reasonable
                terms  and  conditions;
        --    the  outcome  of  ongoing  litigation  as  well  as  any  new  litigation  to  which
                we  may  become  a  defendant;
        --    our  ability  to  close  as  planned  the  merger  of  ST-NXP  Wireless  with
                Ericsson  Mobile  Platforms  as  announced  on  August  20,  2008;
        --    the  effects  of  hedging,  which  we  practice  in  order  to  minimize  the
                impact  of  variations    between  the  U.S.  dollar  and  the  currencies  of  the
                other  major  countries  in  which  we  have  our  operating  infrastructure  in
                the  currently  very  volatile  currency  environments;
        --    our  ability  to  manage  in  an  intensely  competitive  and  cyclical  industry,
                where  a  high  percentage  of  our  costs  are  fixed,  incurred  in  currencies
                other  than  US  dollars;
        --    our  ability  to  restructure  in  accordance  with  our  plans    if  unforeseen
                events    require  adjustments  or  delays  in  implementation;
        --    our  ability  in  an  intensively  competitive  environment  to  secure  customer
                acceptance  and  to  achieve  our  pricing  expectations  for  high-volume
                supplies  of  new  products  in  whose  development  we  have  been,  or  are
                currently,  investing;
        --    the  ability  of  our  suppliers  to  meet  our  demands  for  supplies  and
                materials  and  to  offer  competitive  pricing;
        --    significant  differences  in  the  gross  margins  we  achieve  compared  to
                expectations,  based  on  changes  in  revenue  levels,  product  mix  and
                pricing,  capacity  utilization,  variations  in  inventory  valuation,  excess
                or  obsolete  inventory,  manufacturing  yields,  changes  in  unit  costs,
                impairments  of  long-lived  assets  (including  manufacturing,  assembly/test
                and  intangible  assets),  and  the  timing,  execution  and  associated  costs
                for  the  announced    transfer  of  manufacturing  from  facilities  designated
                for  closure  and  associated  costs,  including  start-up  costs;
        --    changes  in  the  economic,  social  or  political  environment,  including
                military  conflict  and/or  terrorist  activities,  as  well  as  natural  events
                such  as  severe  weather,  health  risks,  epidemics  or  earthquakes  in  the
                countries  in  which  we,  our  key  customers  and  our  suppliers,  operate;  and
        --    changes  in  our  overall  tax  position  as  a  result  of  changes  in  tax  laws
                or  the  outcome  of  tax  audits,  and  our  ability  to  accurately  estimate  tax
                credits,  benefits,  deductions  and  provisions  and  to  realize  deferred  tax

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