IRVINE, Calif, and TOKYO, Oct. 28 /PRNewswire/ -- Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC)*, its subsidiary in the Americas, today announced the launch of a new line-up of 43nm Single-Level Cell (SLC) NAND flash memory products available in densities ranging from 512Mbits(1) to 64Gbits(2) and in a total of 16 versions. The new range includes three products, 16Gb, 32Gb and 64Gb, which integrate 43nm monolithic 16Gb chips, the highest density SLC NAND chips available(3). The new devices will come to market from the first quarter of 2009.
SLC chips offer fast read and write times and support a large number of write and erase cycles. Toshiba developed the new SLC devices to meet diversifying applications, and its enhanced line-up offers support for mobile phones, office automation equipment, and servers, all of which require high levels of read and write speeds and reliability.
In recent years, Toshiba Corporation has promoted expansion of the NAND flash memory market by accelerating development of high density multi-level cell (MLC) chips to be used for high capacity data storage in such markets as memory cards and MP3 players. Production of SLC chips has been limited for Toshiba's 56nm and 70nm process technologies. In bringing a wider range of advanced SLC flash memories suitable for higher performance storage applications into its line-up, Toshiba aims to expand its selection of high-value added products for diverse embedded applications, and will promote mass production through the application of advanced process technology.
Product Number Capacity Package Page Size Mass Production TH58NVG6S2EBA20 64Gb BGA Large Block 2009, 1Q TH58NVG5S2EBA20 32Gb BGA Large Block 2009, 1Q TC58NVG4S2EBA00 16Gb BGA Large Block 2009, 1Q TC58NVG3S2ETA00 8Gb TSOP I Large Block 2009, 2Q TC58NVG2S3ETA00 4Gb TSOP I Large Block TC58NVG2S3EBAJX 4Gb BGA Large Block TC58NVG1S3ETA00 2Gb TSOP I Large Block 2009, 1Q TC58NVG1S3EBAJX 2Gb BGA Large Block 2009, 2Q TC58NVG0S3ETA00 1Gb TSOP I Large Block 2009, 2Q TC58NVG0S3EBAJ5 1Gb BGA Large Block 2009, 2Q TC58DVG02A5TA00 1Gb TSOP I Small Block 2009, 3Q TC58DVG02A5BAJ5 1Gb BGA Small Block 2009, 3Q TC58NVM9S3ETA00 512Mb TSOP I Large Block 2009, 2Q TC58NVM9S3EBAJW 512Mb BGA Large Block 2009, 2Q TC58DVM92A5TA00 512Mb TSOP I Small Block 2009, 3Q TC58DVM92A5BAJW 512Mb BGA Small Block 2009, 3Q
Features of the new products
1. By applying leading edge 43nm process technology and advanced technology to increase data savings, the new products doubled in density compared to 56nm SLC products. This enables the new memories to be applied to products that require higher performance and reliability. 2. The writing speed is 2.5 times(4) faster than comparable Toshiba MLC NAND flash memory.
16G bit product Product Number TC58NVG4S2EBA00 Density 16G bit Power 3.3V Program time 400ms/ page (Typ.) Delete time 4ms/block (Typ.) Access time 40 ms/(1st) 25nano second(Serial) Size 14mm x 18mm
*About Toshiba Corp. and TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2007 WW Semiconductor Revenue, April 2008). For additional company and product information, please visit http://www.toshiba.com/taec/.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at
www.chips.toshiba.com , or from your TAEC representative.