When system engineers develop a multi-core product, they can allocate separate systems (domains) with different characteristics and functions to each CPU core. A distributed-function system design is used so the CPU cores can interoperate and function in an integrated manner. The SH7786 employs technologies developed by Renesas that support distributed-function system design approaches — specifically, communication interface technology for interoperability between the operating systems of multiple domains, and technology for preventing interference between the different operating systems. This enables developers to make use of existing software resources designed for single operating systems. It also enables to build multi-core distributed-function systems in a short amount of time. Additionally, these Renesas-developed technologies support different operating systems simultaneously with high levels of reliability.
Price and Availability
-20°C to +85°C
(25mm × 25mm)
|R8A77860DBGV||-40°C to +85°C|
About Renesas Technology Corp.
Renesas Technology Corp. is one of the world's leading semiconductor
system solutions providers for mobile, automotive and PC/AV (Audio
Visual) markets and the world's No.1 supplier of microcontrollers. It is
also a leading provider of LCD Driver ICs, Smart Card microcontrollers,
RF-ICs, High Power Amplifiers, Mixed Signal ICs, System-on-Chip (SoC)
devices, System-in-Package (SiP) products and more. Established in 2003
as a joint venture between Hitachi, Ltd. (TSE:6501, NYSE:HIT) and
Mitsubishi Electric Corporation (TSE:6503), Renesas Technology achieved
consolidated revenue of 951 billion JPY in FY2007 (end of March 2008).
Renesas Technology is based in Tokyo, Japan and has a global network of
manufacturing, design and sales operations in around 20 countries with
about 26,800 employees worldwide. For further information, please visit