IMEC Newsletter 53 – July 2008
Also, from now on, IMEC’s core partners will be offered the opportunity to use the ADT for their own research and for dedicated exposures, bringing in their own proprietary wafers and EUV reticles.
Although several critical issues still need to be solved, the acceptance of the ADT tool is an important milestone in the development of EUV technology, which is considered the technology for the 22nm half pitch insertion. In addition, IMEC demonstrated the patterning of the contact level of a 32nm SRAM cell, showing good prospects for EUV process integration. In 2010, ASML will install its EUV pre-production tool in IMEC’s 300mm facility.
[Figure [EUV.jpg] 32nm SRAM device after EUV ADT exposures with various doses and after oxide etch.]
News from IMEC’s Apollo program
Renesas collaborates with IMEC on reconfigurable RF transceivers
Renesas Technology Corp., one of the world's leading semiconductor system solutions providers for mobile, automotive and PC/AV (audio visual) markets, has entered into a strategic research collaboration with IMEC to perform research on 45nm RF transceivers targeting Gbit/s cognitive radios. To this end, Renesas has joined IMEC’s software-defined radio (SDR) front-end program. This research program includes reconfigurable RF solutions, high-speed/low-power analog-to-digital converters (ADCs) and new approaches to digitize future RF architectures.
Researchers from Renesas will reside at IMEC to closely collaborate with IMEC’s research team. In this way, they will build a fundamental understanding and develop robust solutions for Renesas future mobile electronics products.
Near term, IMEC’s SDR front-end program targets the development of a new-generation cost-, performance- and power-competitive reconfigurable radio in 45nm digital CMOS technology. This radio will have a programmable center frequency from 100MHz to 6GHz and a programmable bandwidth from 100kHz to 40MHz. It will cover all key communication standards, and have a merit comparable to state-of-the-art single-mode transceivers.
The research program builds on IMEC’s previous groundbreaking 130nm RF transceiver results (published at ISSCC 2007), which represented the world’s first prototype of a true SDR transceiver IC (SCALDIO). Also, further evolutions of IMEC’s record breaking ADCs (merit record by IMEC at ISSCC 2008 of 40Msamples/s, 9 bit, 54fJ/conversion step) will be developed within this collaboration.
This collaboration underlines the importance of IMEC’s recent results on SDR and ADCs, and stresses the value IMEC brings to its industry partners in this RF research program.
[Figure Renesas.jpg Renesas collaborates with IMEC on reconfigurable RF transceivers.]
News from Holst Centre
Singulus Mastering and Bekaert extend and expand participation in Holst Centre
Holst Centre has recently expanded its collaboration with two existing partners. For the young organization, this confirms that it has grown into a solid partner in research.
Bekaert, a world leader in advanced metal transformation and advanced materials and coatings, joined the two Holst Centre program lines on wireless autonomous transducer systems and system-in-foil in May 2006. After a successful two-year collaboration, the company decided to extend its commitment and strengthen its participation in several of the Holst Centre programs.
Singulus Mastering, market leader for optical disc production lines, enters into a full partnership in the Holst Centre lithography-on-foil program after an initial feasibility study that started in 2007. Erwin Meinders, Holst Centre Program Manager Lithography on Foil: “We are pleased to notice that our business model of consulting potential partners for the definition of a shared roadmap effectively leads to a win-win collaboration agreement that leaves room for various parties to join.”
Holst Centre was set up in 2005 by the renowned research centers IMEC (Belgium) and TNO (The Netherlands). From the start, it could count on considerable support from the government, academia and industry. During the pioneering phase, collaborations for shared research were signed with over 15 leading industrial partners. After two years, several of the initial contracts are evaluated in view of a continued collaboration.
NOTE about FutureFab
Download the latest edition of Future Fab International magazine at http://www.future-fab.com
Gilbert Declerck, CEO, IMEC and Lode Lauwers, Director Strategic Program Partnerships, IMEC participate in Future Fab’s editorial board, sharing their experience and industry outlook with the semiconductor community.
[picture FAB_logo_print_cmyk.tif ]
Bottom-up and top-down nanotechnology
November 12-14, 2008, IMEC, Leuven, Belgium
Organized by MTC and Marc Madou, University of California, Irvine, US
‘Bottom-up and top-down nanotechnology’ is a course for the broad audience of scientists and engineers from industry and academia with a keen interest in which technologies will supersede current electronics. The course should help academic and industry decision makers to make educated decisions on future R&D investments.
MEMS: Technology, design and applications
December 8-9, 2008, IMEC, Leuven, Belgium
This two-day training course focuses on the combination of NEMS/MEMS technology with standard CMOS. The emphasis will be on monolithic integration, i.e., processing of MEMS and CMOS on the same substrate. Also, close hybrid integration through transfer and wafer bonding techniques will be discusses and both processes will be compared. The course will deal with technology issues (manufacturing options and test) as well as application issues (products, markets). Design will be covered from a development point of view.
The course targets managers, project leaders, process engineers and technicians of standard CMOS wafer and MEMS fabs, equipment vendors and material suppliers.
Adhesion Science and Technology
December 8-9, 2008, IMEC, Leuven, Belgium
Adhesion plays an important role in many technologies and industries, namely automotive, thin films, optics, printing, medical, coatings, paint and so on. The need for understanding and controlling the factors affecting adhesion is quite patent. Also, the durability of the bond (on exposure to process chemicals, moisture, corrosives etc) is of grave concern and importance.
This two-day course provides up-to-date information on the factors affecting adhesion and introduces various ways to enhance adhesion in a host of situations. The target audience is research, development and manufacturing personnel who need a thorough knowledge of adhesion science and technology.
More information and a full overview of courses: www.imec.be/mtc
EU PVSEC – 23rd European Photovoltaic Solar Energy Conference and Exhibition – Booth #3/B 8
September 1-5, 2008, Feria Valencia, Valencia, Spain
EU PVSEC is the most important international conference in the field of photovoltaics. The international collaboration, which the EU PVSEC facilitates, is essential in fostering a sustainable future for PV technology in the global energy system. During the exhibition, you can visit IMEC and discover recent progress made in bulk-Si solar cells (i-PERC and next generations), thin-film Si solar cells, organic solar cells, III-V solar cells and Ge thermophotovoltaic cell technology.
More information: www.photovoltaic-conference.com
UCPSS 2008 – 9th International Symposium on Ultra-Clean Processing of Semiconductor Surfaces
September 22-24, 2008, Bruges, Belgium
The Symposium on Ultra-Clean Processing of Semiconductor Surfaces is a biannual event that aims to increase the level of understanding on ultra-clean processing technology in all steps of the IC production. Paul Mertens, manager of IMEC’s program on contamination control, cleaning and surface preparation, will be the conference chairman.
More information: www.ucpss.org
5th International Symposium on Immersion Lithography Extensions
September 22-25, 2008, The Hague, The Netherlands
You are invited to join industry experts from around the world in presenting new and unique research results. Now in its fifth year, this symposium continues to focus on the progress in 193nm high-index immersion lithography, double patterning and other extensions to optical lithography, and to build consensus on how the industry will address emerging critical issues. IMEC, in cooperation with SEMATECH and Selete, will host this year’s Immersion Symposium.
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