The seminar, which will feature guest speakers from leading semiconductor industry research consortia, is being held in conjunction with the IEEE International Interconnect Technology Conference (IITC). The presentations will include: "Recent Ru Thin Film Technologies for Cu Interconnect", presented by Dr. Shinichi Ogawa, chief researcher at Selete; and, "Material Aspects of Low-k Integration", addressed by Mikhail Baklanov, principal scientist AMPS Division at IMEC.
To conclude the program, ASMI will host a Poster Session addressing advanced interconnect technologies such as UV cure and Metal Hardmasks for ELK, materials for LSI MIM Capacitors, novel Copper Barrier materials, and will feature ASMI's new high productivity platform, the Eagle® XP.
Those interested in attending this event should reply by e-mail to Email Contact.
ASM International N.V., headquartered in Bilthoven, the Netherlands, and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International's common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI's web site at www.asm.com.
Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics and other risks indicated in the Company's filings from time to time with the U.S. Securities and Exchange Commission, including, but not limited to, the Company's reports on Form 20-F and Form 6-K. The Company assumes no obligation nor intends to update or revise any forward-looking statements to reflect future developments or circumstances.
Contacts: Mary Jo Dieckhaus Investor Relations +1 212-986-2900 Email Contact
ASM International N.V. to Host Interconnect Technology Seminar: http://hugin.info/132090/R/1224410/258596.pdf
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