ASM International N.V. to Host Interconnect Technology Seminar

BILTHOVEN, NETHERLANDS -- (MARKET WIRE) -- Jun 02, 2008 -- ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM) will host an interconnect technology seminar addressing the integration of extreme low-k materials and ALD metals, on Tuesday, June 3, 2008 at the Hyatt Regency San Francisco Airport Hotel in Burlingame, CA.

The seminar, which will feature guest speakers from leading semiconductor industry research consortia, is being held in conjunction with the IEEE International Interconnect Technology Conference (IITC). The presentations will include: "Recent Ru Thin Film Technologies for Cu Interconnect", presented by Dr. Shinichi Ogawa, chief researcher at Selete; and, "Material Aspects of Low-k Integration", addressed by Mikhail Baklanov, principal scientist AMPS Division at IMEC.

To conclude the program, ASMI will host a Poster Session addressing advanced interconnect technologies such as UV cure and Metal Hardmasks for ELK, materials for LSI MIM Capacitors, novel Copper Barrier materials, and will feature ASMI's new high productivity platform, the Eagle® XP.

Those interested in attending this event should reply by e-mail to Email Contact.

About ASM

ASM International N.V., headquartered in Bilthoven, the Netherlands, and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International's common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI's web site at www.asm.com.

Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics and other risks indicated in the Company's filings from time to time with the U.S. Securities and Exchange Commission, including, but not limited to, the Company's reports on Form 20-F and Form 6-K. The Company assumes no obligation nor intends to update or revise any forward-looking statements to reflect future developments or circumstances.

Contacts:
Mary Jo Dieckhaus
Investor Relations
+1 212-986-2900

Email Contact

ASM International N.V. to Host Interconnect Technology Seminar: http://hugin.info/132090/R/1224410/258596.pdf

Copyright © Hugin AS 2008. All rights reserved.







Review Article Be the first to review this article
Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Qualcomm’s Lu Dai: Energetic leadership for Accellera
More Editorial  
Jobs
Sr. Staff Design SSD ASIC Engineer for Toshiba America Electronic Components. Inc. at San Jose, CA
Development Engineer-WEB SKILLS +++ for EDA Careers at North Valley, CA
SOC Logic Design Engineer for Global Foundaries at Santa Clara, CA
Technical Support Engineer for EDA Careers at Freemont, CA
Principal Engineer FPGA Design for Intevac at Santa Clara, CA
Upcoming Events
IoT Summit 2017 at Great America ballroom, Santa Clara Convention Center Santa Clara CA - Mar 16 - 17, 2017
SNUG Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Mar 22 - 23, 2017
CDNLive Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Apr 11 - 12, 2017
10th Anniversary of Cyber-Physical Systems Week at Pittsburgh, PA, USA PA - Apr 18 - 21, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy