New Photocouplers in 4-Pin Plastic DIP Meet Requirements for Reinforced Insulation Class International Safety Standards VDE, UL, BSI and SEMKO
Developed by Toshiba Corp. (Toshiba), the TLP781 photocoupler and the TLP781F, a variation with wide lead spacing, meet reinforced insulation class UL, BSI, SEMKO and VDE international safety standard requirements(1). The TLP781 is functionally equivalent to the existing Toshiba TLP421 photocoupler.
"These photocouplers are intended to assist customers working on designs that may be intended for global shipment and thus must meet the requirements for all major safety standards," said Jay Heinecke, business development director, Discrete Business Unit, for TAEC.
The new photocouplers consist of a silicone photo-transistor optically coupled to a gallium-arsenide infrared emitting diode in 4-pin DIP packages that measure only 6.5mm x 4.6mm x 3.5mm high. The TLP781 standard type features 7.62mm lead pitch, while the TLP781F wide lead version features 10.16mm pitch. The devices feature collector-emitter voltage of 80V (min.) with a current transfer ratio of 50 percent (min.). The operating temperature (Topr) is -55 to 110 degrees C (max.).
Technical Specifications Product Characteristics Symbol TLP781/TLP781F LED Forward voltage V(F) 1.3V (max.) Reverse current I(R) 10 microamperes (max.) Capacitance between terminals C(T) 30pF (typ.) Detector Collector-to-emitter breakdown voltage V(BR)CEO 80V (min.) Emitter-to-collector breakdown voltage V(BR)ECO 7V (min.) Collector dark current ID(ICEO) 0.1 microamperes (max.) Collector to emitter capacitance C(CE) 10pF (typ.) Current Transfer Ratio (CTR) I(C)/I(F) 50% (min) 600% (max.) Saturated CTR I(C)/I(F)(sat) 60% (typ.) at I(F)=1ma, V(CE) = 0.4V Input-to-output stray capacitance C(S) 0.8pF (typ.) Isolation resistance R(S) 10(14) ohms (typ.) Isolation voltage BV(S) 5000V(RMS) (min.)
Pricing and Availability
Samples of the TLP781 photocoupler and TLP781F photocoupler with wide lead spacing are available now, priced at $0.20 in sample quantities.
Toshiba's Discrete Products
Since 1986, Toshiba Corp. has ranked as the top discrete supplier on a worldwide basis, based on annual revenue from international shipments of total discrete products. According to the most recent annual report from market research firm Gartner Dataquest (San Jose, CA), Toshiba remained the top discrete semiconductor supplier. (Source: "2007 Worldwide Semiconductor Market Share Report," Gartner, released April 2008). More specifically, Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers and thyristors, LMOS logic, CMOS logic, optoelectronics, small signal diodes and transistors. The company's discrete devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, while emphasizing its strength in the automotive and industrial markets.
* About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2007 WW Semiconductor Revenue Ranking, April 2008). For additional company and product information, please visit http://www.toshiba.com/taec/.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.chips.toshiba.com, or from your TAEC representative.
(1) UL recognized: UL1577, file No. E67349
BSI approved: EN60065:2002, Approved No. 8961; EN60950-1:2006, Approved No. 8962
SEMKO approved: EN60950-1:2001, EN60335-1:2002, Approved No. 800517
Option (D4) type VDE approved: DIN EN60747-5-2, Certificate No. 40021173
Note: When an EN60747-5-2 approved type is needed, please designate "Option(D4)".