Agilent EEsof, High Frequency Leader

Other IP & SoC News

  • Redefining the Architecture of Memory (New York Times)
  • Jazz Semiconductor Announces Analog-Intensive Mixed-Signal (AIMS) Initiative  
  • STMicroelectronics Introduces Next-Generation Secure MCUs Based On 0.13-Micron Process Technology
  • IPextreme Aligns With Infineon to Open and Promote Valuable MLI and MSC Interface Standards Specifications  
  • Broadcom Delivers Flexible New Wi-Fi(R) Workhorse That Slashes Cost, Size and Power for PCs, Broadband Gateways and Gaming Platforms 
  • NVIDIA Quadro FX 5600 Architecture Now Available Top-To-Bottom
  • TI Delivers SimpliciTI(TM) Network Protocol for Simple, Low-Power RF Networks 
  • Atmel's AT90SC256144RCFT Secure Microcontroller Qualified by FIME for ePassport Applications 
  • ChipMOS FILES PATENT INFRINGEMENT SUIT AGAINST WALTON CHAINTECH CORPORATION
  • New IBM Technology Enables Single-Chip Mobile Solutions
  • Samsung Introduces 60nm-class Processing for 2Gb DDR2 DRAM 
  • NANOIDENT Developer to Speak about the Next Generation of Printed Lab-on-a-Chip Devices at SPIE Europe Security & Defence 2007  
  • ARC Signs Licensing Agreement for Configurable Solutions For Next-Generation Computing Products
  • Xilinx and Barco Announce Single-Chip JPEG2000 Implementation 
  • Intelleflex Unveils Strategic Partner Program to Deliver Extended Capability RFID Solutions  
  • TI Updates Third-Quarter 2007 Business Outlook
  • FSA Releases Hard Intellectual Property Quality Risk Assessment Tool Version 3.0  
  • Explore Why the NAND Technology Market Has Grown to Sales of $16 Billion in Less Than Ten Years  
  • BiTMICRO to Debut 416GB IDE Flash Solid State Disk Packed in 2.5-Inch Rugged Hard Disk Drive Footprint
  • Jungo and Atheros Unveil Draft 2.0 802.11n Reference Designs for High Speed Residential and Business Gateways
  • Fujitsu Developing ASICs for GPS Receivers with Industry Leader NovAtel
  • ANADIGICS Ships 802.11n Power Amplifiers to NXP Semiconductor for WLAN Module Solution
  • Mixel Announces Two New PLLs Featuring Higher Performance, Reduced Power, Cost and Die Area at the 2007 FSA Expo and Conference
  • Aviza Technology and Mosel Vitelic Corporation Announce Joint Development Program
  • Xilinx XtremeDSP Solutions Enable Canopus High Definition Digital Recording System From Thomson
  • AMBARELLA UNVEILS INDUSTRY'S FIRST SINGLE-CHIP 1080P60 "FULL HD" BROADCAST ENCODER PLATFORM
  • OKI Ships Samples of ML7246, an IEEE802.15.4 Wireless LSI Equipped With USB Interface
  • Conexant's HDTV Video Decoders Win 'Best Silicon Innovation' in Annual Cable and Satellite Award Competition    
  • ViXS Launches New HD AVC Video Processor Family    
  • Intersil Corporation Acquires Planet ATE, Supplier of the World's Most Highly-Integrated Analog Pin Electronics for IC Test Equipment    
  • Arrow North American Components and IBM Collaborate On Advanced Chip Design and Manufacturing Services  
  • New RF Synthesizer with Integrated VCOs from STMicroelectronics Stretches Out to 5GHz
  • Intel Updates Third-Quarter Revenue and Gross Margin Expectations  
  • Top Layer Networks To Develop Next-Generation Network Security Solutions Using Newly-Unveiled TILE64 Multi-Core Chips from Tilera Corporation
  • Samsung 64GB Solid State Drives Now Shipping  
  • TI Boosts Portable Audio Performance With 2.7-W Constant Output Power Class-D Amplifier    
  • Atmel's UHF ASK/FSK Receiver ICs for TPMS and RKE Applications Provide Best Trade-off between High Integration, High Performance and Worldwide Frequency Coverage    
  • RadiSys Enters Into Agreement to Acquire Intel's Modular Communications Platforms ATCA, CPCI, & Legacy Business Assets  
  • Gateway Servers to Offer New Quad-Core AMD Opteron(TM) Processors    
  • Lattice Delivers Industry's Lowest Power, Smallest Footprint Programmable Bridge Solution    
  • Conexant Delivers Industry's Lowest Power, Single-Chip 802.11n Product Family
  • Freescale 8-bit, 8-pin Device for Entry-Level Automotive Applications Delivers Small Footprint, High Integration    
  • Sequans Introduces the Industry's First MAC/PHY Chip for Mobile WiMAX Base Stations  
  • ApaceWave Introduces the APW-2000 Mobile WiMAX Wave 2 Baseband SoC  
  • AMD Introduces the World's Most Advanced x86 Processor, Designed for the Demanding Datacenter  
  • Xilinx FPGAs and Design Tools Enable Echolab's Latest Multi-Definition Video Switcher


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    • informative article July 16, 2008
      Reviewed by 'Ranganath'
      Interesting article. Recommended for those wish to know about Agilent Eesof business.

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