Agilent EEsof, High Frequency Leader

Which product area is the greatest contributor to revenue?
Right now it is ADS, a very large installed base, a very flexible tool for use in chips, boards, and system level. It has a long history and lots of customers are trained on it. It has an infrastructure built around it. It is really our flagship product.

In terms of future direction, is there anything beyond simply more of the same?
It is really focused on the areas we are in right now. The opportunities to solve those problems are really, really strong. We are keeping focused on that.

Is the sales model direct, indirect or a mixture?
It is almost all direct. That goes back to the Eagleware acquisition. ADS and other products are generally sold to large companies. It is very technical. We have a very technical based sales force. Technical people in the field outnumber the sales people by a fair margin. But with the Eagleware product lines, we are starting to build a more manufacturers rep type sales channel. It is good timing too because Agilent Instrumentation is moving into the handheld or lower cost, basic instruments. That organization is also building an indirect channel. So we are leveraging and combining forces. That allows us to pick the top distributors around the world to carry these lower cost products into broader markets. It is really good timing and synergy with the rest of the test and measurement portfolio.

Are there any differences on a geographic basis?
Each geography has some challenges. The US has a wide range of very small startups to very large corporation. In Asia there is a real challenge of just geography; companies are spread very far around. We will tend to use more manufacturing reps in that area. Then there are some emerging areas like Eastern Europe countries where they are just building up there electronic infrastructures. We will use reps in those areas like Latin America. But in the major centers we put our direct sales folks. In places like China we are very strong, previously being inside HP. HP was one of the first companies inside China. We have a strong infrastructure in that part of the world.

Do you see the Chinese moving into the high frequency area at the same rate as the US and Europe?
I think they are moving a lot faster. When you go to China there is a real energy there. There are a number of companies that have been very, very successful there quickly. They will grow to multibillion dollar size companies within 10 to 15 years. There are a lot of people who worked for large companies in the US or Europe that went back home to China and are now running these R&D departments or even companies. They know what to do and how to do it. There is a lot of cooperation with the local governments. There are a lot of very smart people and they are going for it. Their own phones, routers, … It is an exciting place to be. There is a lot of investment going in there. A lot of success. It is very interesting. We have tripled our sales force in China in the last three years.

Anything you would like to add? Anything we missed?
We covered a bunch.

The top articles over the last two weeks as determined by the number of readers were:

Extreme DA, The Technology Leader in IC Timing Analysis, Opens New World Headquarters  Extreme DA opened new corporate headquarters in Santa Clara, moving from its original offices in Palo Alto, Calif. "To accommodate our growing staff, our new headquarters is five-times larger than our former offices," said Mustafa Celik, CEO of Extreme DA. "In just one year, our staff has increased by 100 percent, and we are aggressively recruiting to add more employees to our team by year-end." Extreme DA develops and licenses software products to improve the performance and yield of nanometer integrated circuits

AWR Introduces AXIEM - Innovative New EM Technology That Transforms Microwave/RF Electronic Product Design  Applied Wave announced AXIEMT electromagnetic (EM) design software, a design tool that delivers EM analysis as a true upfront design technology, where it benefits designers most by helping to diagnose issues early, thereby significantly shortening the design process. The AXIEM product was developed specifically for 3D planar applications such as RF (PCBs and modules, low temperature co-fired ceramic (LTCC), monolithic microwave integrated circuit (MMIC), and RFIC designs, which are the heart of today's electronic designs.

US Patent Office Issues Simulation Patent to Zeidman Consulting  Zeidman Consulting, a Silicon Valley contract research and development firm, has been granted U.S. Patent Number 7,266,490, entitled "Apparatus and Method for Connecting Hardware to a Circuit Simulation."

This patent covers software for a hardware simulation to communicate directly with real hardware. Through the patented software, the simulation acts as though the simulated device is connected directly to the real hardware. This technology is an extension of the methods first commercialized in the Molasses software program that enables a live network to be connected to an emulator or prototype.

What You Design Should Be What You Get, Says EDA Leader Cadence  Mike Fister, President and CEO of Cadence Design Systems,speaking at the annual CDNLive! User Conference said "Fundamentally, what is at stake is the quality of electronic products today. The electronics industry simply cannot afford to find problems in manufacturing. The best place for fast, efficient, cost-effective correction, analysis, repair and optimization is at the designer's desk. If the chip is correct by design, there should be few unexpected problems once it is manufactured; What you design is what you will get."

Other EDA News

  • Pulsic Awarded Patent for Productivity Improving Spine-and-Stitch Chip Design Software  
  • Synopsys HSPICE Simulator and SiSoft Quantum-SI Combine to Deliver Robust Signal Integrity Analysis Solution  
  • Cadence Accelerates Time-to-Volume for Advanced ICs With Model-Based, Variation-Aware Design Technologies
  • Evatronix USB subplatforms enable easy design-in of USB connectivity into System on Chips.   
  • PLDA Announces Innovative Business Expansion into "Application IP", (AIP) Bringing Their Bus IP Design Expertise to High-Growth Vertical Markets    
  • Reminder - Kilopass Showcases Proven, Embedded Non-Volatile Memory IP for 180 nm, 130 nm, 90 nm and 65 nm Standard CMOS Processes at 2007 FSA Suppliers Expo and Conference
  • Altera Unveils Industry's First Plug & Play Signal Integrity Technology
  • MediaTek and Apache Partner to Address 65/45nm Design Challenges  
  • Reminder - True Circuits' Analog PLL & DLL Hard Macros Featured at FSA Suppliers Expo  
  • Voltaire and Synopsys Introduce High-Performance Compute Solution to Reduce Cycle Time for Semiconductor Mask Manufacturing    
  • What You Design Should Be What You Get, Says EDA Leader Cadence
  • Extreme DA, The Technology Leader in IC Timing Analysis, Opens New World Headquarters
  • AWR Introduces AXIEM - Innovative New EM Technology That Transforms Microwave/RF Electronic Product Design    
  • Appro Announces Support for Quad-Core AMD Opteron™ 2300 and 8300 Series Processors    
  • MOSAID Announces Normal Course Issuer Bid    
  • SoftJin Announces Blaze DFM as Its Customer, Outsourcing of EDA Software Components Development Is a Win-Win Strategy for DFM Company    
  • Dolphin Integration announces the availability in September 2007 of Third Generation Schematic Link EDitor, named SLED.    
  • Apache Design Solutions to Host Technology Seminars in Taiwan and Japan    
  • FLO/PCB Version 4.1    
  • LogicVision Provides Desktop Silicon Characterization and Diagnostics Solution with the Introduction of Silicon Insight(TM)    
  • Carbon Design Systems' Popular Webinar Series Continues With Seminar on Automatic Model Generation for MIPS' MIPSsim Instruction Set Simulator  
  • The MathWorks Introduces RF Blockset 2    
  • Appro Announces Support for Quad-Core AMD Opteron(TM) 2300 and 8300 Series Processors    
  • PLDA Announces Innovative Business Expansion Into "Application IP", (AIP) Bringing Their BUS IP Design Expertise To High-Growth Vertical Markets
  • AWR Introduces AXIEM -- Innovative New EM Technology That Transforms Microwave/RF Electronic Product Design  
  • Stratosphere and Cadence Collaborate to Drive 45 Nanometer Design Yield and Performance Higher
  • ARC Announces Ultra Low Power Technology "Energy PRO" That Lowers Core and Subsystem Power by Four Fold

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  • Rating:
    Review Article
    • informative article July 16, 2008
      Reviewed by 'Ranganath'
      Interesting article. Recommended for those wish to know about Agilent Eesof business.

        Was this review helpful to you?   (Report this review as inappropriate)

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