Ansoft Releases ePhysics v2; New Release Provides Dynamic-Link Co-Simulation of Thermal and Stress Analysis With HFSS and Maxwell 3D

PITTSBURGH—(BUSINESS WIRE)—Aug. 2, 2006— Ansoft Corporation (NASDAQ: ANST) today announced the immediate availability of ePhysics(TM) v2. This latest version enhances ePhysics' 3D steady-state thermal, transient thermal and linear stress analyses coupling to HFSS(TM) and Maxwell(R) 3D with dynamic-link co-simulation. The new capability allows engineers to simulate heating, stress and deformation consequences of high- and low-frequency electromagnetic fields.

ePhysics v2 responds to the market demand to have an integrated, multi-disciplinary approach to electrical component design, essential for devices operating under high power, faster data rates and reduced physical size, where thermal and mechanical effects need to be evaluated due to their influence on the overall performance.

The ePhysics user interface, including design management front-end, 3D modeler, parametric control, simulation set-up and post-processing interfaces, have been migrated to the Ansoft desktop concept shared by HFSS and Maxwell 3D. Engineers can easily account for the thermal and mechanical quantities that significantly contribute to a design's overall performance directly within the familiar, easy-to-use, Ansoft environment.

Coupling ePhysics with Maxwell 3D provides the cross-disciplinary analysis required in the design of electromechanical devices. Typical applications include the analysis of electric machines, power-generation systems, transformers, microelectromechanical systems (MEMS) and solenoids.

"Now that ePhysics v2 can be coupled directly to Maxwell, we are able to assess the thermal and stress behavior of magnetic components very conveniently," said Richard Osman, PE, principal product engineer, Siemens Energy & Automation Inc. "This advanced capability from Ansoft has greatly improved our ability to validate and optimize our designs before building hardware."

HFSS with ePhysics is vital for applications such as high-speed packages, antennas, monolithic microwave integrated circuits (MMICs), high-power microwave devices, military and broadcast communications and biological heating with radio frequency (RF) sources. These analyses include high-power, temperature-induced stress and size changes of design components.

New features include:

-- New Ansoft desktop interface

-- Dynamic-link coupling with Maxwell 3D and HFSS, which includes automatic mapping of power loss and force densities integrated with adaptive meshing technology

-- Multiple design couplings that may be "daisy chained" in the process of creating complex applications

-- Maxwell Transient - Thermal Transient

-- HFSS Transient Sequence - Thermal Transient

-- Nonlinear thermal properties (conductivity vs. Temp)

-- Anisotropic stress solution

-- 64-bit solvers available

ePhysics is available immediately for PC and UNIX(R) platforms. To learn more, visit www.ansoft.com/ephysics.

Editors: To download three high-resolution ePhysics images and captions, please go to ftp://ftp.ansoft.com/techsup/download/web/primg/ephysics_v2.zip.

About Ansoft

Ansoft is a leading developer of high-performance electronic design automation (EDA) software. Engineers use Ansoft software to design state-of-the-art electronic products, such as cellular phones, Internet-access devices, broadband networking components and systems, integrated circuits (ICs), printed circuit boards (PCBs), automotive electronic systems and power electronics. Ansoft markets its products worldwide through its own direct sales force and has comprehensive customer-support and training offices throughout North America, Asia and Europe. For more information, please visit www.ansoft.com.



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