Return on Investment


Keynote Interview at MicroVentures 2005 Conference Features Cadence CEO Mike Fister

Altium Strengthens US Presence in Response to Customer Demand

Cadence Delivers New RF Design Kit Targeting Customer Design Challenges in Wireless; Latest Kit Continues Cadence Execution on Strategy to Address Key Vertical Market Applications

Other IP & SoC News

Zarlink Simplifies Timing for SONET/SDH Networking Equipment with Industry's Lowest Jitter Single-Chip Synchronizers

TI Introduces Family of Programmable Analog Video Signal Processors With I2C, Integrated Filters and 3.3-V Operation

Tripath to Showcase New Products at the 2006 Consumer Electronics Show; Company Plans to Introduce the First Trivici-Based Amplifier and Display New Class-T iPod Docking Stations and other Consumer Audio Electronics

STMicroelectronics Unveils Innovative Network-on-Chip Technology for New System-on-Chip Interconnect Paradigm

Rambus Inc. Adopts Register Description Language and Licenses Denali's Blueprint Software for IP Development Process

ON Semiconductor Raises Revenue Guidance for Fourth Quarter 2005

IBM Takes Next Step in Opening Power Architecture to Research and Education Community

Maintaining Low-power Consumption is Critical to Drive Wireless Internet on a Chip Technology

Texas Instruments Announces Availability of Denali's Databahn(TM) DDR Controller IP to TI ASIC Customers

Atmel's High-performance UHF IDIC Demo Kit Supports Long-range RFID Applications

Vitesse Introduces Grooming Switches That Enable Lowest Cost, Next-generation Access and Metro Equipment; Scalable, Low Power Design Ideal for Growing Broadband Services While Maintaining Compatibility with Existing Equipment

Texas Instruments Expands Tag-it ISO/IEC 15693 RFID Product Line

Novel DC/DC Converter from STMicroelectronics Provides Two Regulated Supply Rails Using Only One External Coil

NVIDIA to Acquire ULi Electronics, a Leading Developer of Core Logic Technology

FEI Company and PDF Solutions(R) Release Powerful New Semiconductor Defect Analysis Solution

Atmel Extends Its AVR CAN Microcontroller Family for Industrial CAN Applications

Hitachi and Renesas Technology Develop Low-Power MOS Phase-Change Memory Cells for On-Chip Memory of Microcontrollers

Ramtron Introduces the Versa Mix 8051 Family of Highly Integrated Mixed-Signal Microcontrollers for the Embedded Data Acquisition Market

Semtech's RailClamp Device Sets New Size and Performance Standards for Protection of High-Speed Data Interfaces

Among Makers of Memory Chips for Gadgets, Fierce Scrum Takes Shape (The New York Times)

Analog Devices Introduces Fastest 14-Bit Analog Front End for High-Definition Image Processing Applications; Canon selects ADI's AD9970 analog front end to enable its HDV camcorder.

ANADIGICS Announces New Family of WLAN Front-End Solutions for Mobile and MIMO Markets

Sigma Designs to Work on Full-Featured Blu-ray Player with Pioneer; New Player Utilizes Sigma's Industry-Leading SMP8630 Family of Media Processors

Avago Technologies Introduces Industry's First Quad Bi-Directional Digital Optocoupler

Unlocking New Possibilities in System Development, Actel Ships World's First Mixed-Signal FPGA

National Semiconductor Introduces Industry's First Stereo Audio Subsystem With Both Digital and Analog Inputs

Mobilic Introduces New Multimedia SoC Processor Family

Semiconductors Up 95% From 2003; Are Silicon Cycles a Thing of the Past?

Ambarella Launches Industry's First HD H.264 System-on-Chip for Hybrid Digital Cameras

Vitesse Extends Leadership in Managed Layer 2 Gigabit Ethernet Switching With the Production Availability of the VSC737x Family; VSC737x Family Offers Scalable, Inexpensive, Managed, Layer 2 Switch Solutions for OEMs and ODMs

AMI Semiconductor Launches Stepper Motor Controller ICs with Sensorless Stall Detection; LIN and Serial Interface ICs Improve Reliability and Reduce Component Count, Cost and Complexity of Automotive and Industrial Motion Control Applications

Sun Microsystems and Synopsys Collaborate to Certify VCS Verification Solution for the Solaris 10 OS on x64 Platforms

Synopsys Expands Mixed-Signal IP Portfolio With Interface Cell Libraries Featuring DDR2 SDRAM I/Os

Keynote Interview at MicroVentures 2005 Conference Features Cadence CEO Mike Fister

Inphi Tapes Out High-Speed Flip-Chip Design with Cadence Encounter Platform; Encounter Global Synthesis and Physical Implementation Help Inphi Corp. Achieve 666 MHz at 130-nm with Flip-Chip Package

CORRECTING and REPLACING Sequence Closes $5.3 Million Funding Round; Expands Into Fast-Growing International Markets, Boosts R&D To Maintain Low-Power Tech Lead

Sequence Closes $5.3 Million Funding Round; Expands Into Fast-Growing International Markets, Boosts R&D To Maintain Low-Power Tech Lead

Teradyne and Cadence Address Improved Test and Diagnostic Flow for Nanometer Devices

IEEE Ratifies SystemC 2.1 Standard for System-Level Chip Design; IEEE(R) 1666 Allows Faster System-on-Chip Design, Intellectual Property Exchange

eSilicon Accelerates Design Cycles with Novas Verdi Debug System; Debug System's Ability to Navigate Large, Complex Designs Streamlines eSilicon's Custom IC Design Flows

MatrixOne to Host PLM Live Web Seminar Tomorrow In Europe to Discuss Synchronous Product Development for High Tech Companies

Keynote Interview at MicroVentures 2005 Conference Features Cadence CEO Mike Fister

Altium Strengthens US Presence in Response to Customer Demand

Cadence Delivers New RF Design Kit Targeting Customer Design Challenges in Wireless; Latest Kit Continues Cadence Execution on Strategy to Address Key Vertical Market Applications

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