Spatially Distributed 3D Circuit Models - Technical Paper from DAC 2005

IBM

Paper by Michael Beattie, Hui Zheng, Byron Krauter, and Anirudh Devgan.

Spatially distributed 3D circuit models are extracted with a segmentto-segment BEM (Boundary Element Method) algorithm for both capacitance and inverse inductance couplings rather than using the raditional net-to-net approach. Critical issues regarding the extraction efficiency and accuracy of segment-to-segment BEM capacitance models are explored. An adaptive discretization scheme is developed for segment-to-segment capacitance extraction and also applied to segment-to-segment high-frequency inverse inductance extraction. We demonstrate the limitations of the duality between capacitance and inverse inductance. Examples demonstrating the accuracy of these models are presented for real packaging cases.


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