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PMC-Sierra Reports Third Quarter 2005 Results

Intel Makes Multimedia Services Faster, Easier and More Affordable

Intel's Next-Generation Wi-Fi Solution to Support Cisco Compatible Extensions

CEVA Xpert-Teak DSP Subsystem Powers National Semiconductor's New CP3SP33 Telematics Chip Targeting Analog-Rich Automotive Multimedia Applications

Cypress Introduces World's First Industrial Grade High-Speed USB 2.0 Microcontroller; New Offering Supports Temperature Range of -40 Degrees C to +105 Degrees C for Industrial, Automotive and Military Applications

FSA Announces 2005 FSA Suppliers Expo Taiwan & Semiconductor Leaders Forum; Second Annual Event to Feature Four Keynote Presenters

Toshiba Expands White LED Driver Product Line With White LED Driver IC That Powers Up to 8 LEDs in Series

Broadcom Completes Acquisition of Athena Semiconductors, Inc.

TI Introduces High Accuracy, 4-20mA Transmitter for Industrial Sensors and Monitors

SafeNet Announces Security Processor for SME Networking Equipment; SafeXcel-5150 is the First Security Processor Purpose-Built for Fast Ethernet Bandwidth

AMI Semiconductor Launches World's Smallest Single-Chip Stepper Motor Driver-Controller ICs

National Semiconductor Samples Industry's Lowest-Wire-Count LVDS Chipset for Flat Panel Displays in Automotive, Industrial and Security Applications

North American Semiconductor Equipment Industry Posts September 2005 Book-to-Bill Ratio of 1.02

Linear Technology Reports Increased Sales and Pro Forma Profits Over The Similar Quarter In The Prior Year

Intel Announces Record Revenue of $9.96 Billion; EPS of 32 Cents Includes Legal Settlement that Lowered EPS by Approximately 2 Cents

Motorola Announces Record Third-Quarter Sales and Earnings

TI MSP430 MCU First to Break 500 Nano-amp Barrier Ember Ships Samples of ZigBee System-on-a-Chip; Combo 802.15.4 Radio and 16-Bit ZigBee Processor Chip Sends Packets More Than Twice as Far as Competitors

National Semiconductor Introduces Industry's First Average-Program Load-Share Controller

LSI Logic RapidChip(R) Technology Breaks $10 Barrier for Custom Single-Chip PCI Express Applications

Atmel's RF Tuner T4260 Supported by TI to Expand Developer Flexibility, and to Reduce Cost for HD Radio Receivers

Broadcom Expands Mobile Multimedia Processor Family

TI Introduces 50 Percent Smaller, Pb-Free, Boost and Buck-Boost Power Modules with Wide Output Voltage Range

Two New 16 Channel High Voltage Analog Switches From Supertex Deliver Improved Density and Performance

STMicroelectronics Delivers Single-Chip Power Management Solution for Notebook PCs and Portable Systems

IC Interconnect Announces New Wire-Bonding Process for High-Temperature Applications; Electroless Ni/Immersion Au Process Receives Positive Customer Reviews as a Wire Bond Surface after Rigorous Testing

SEQUANS Communications Announces Availability of Its First System-on-Chips for WiMAX Subscriber Stations and Base Stations

ChipX Announces New Structured ASIC Family with Embedded PCI Express PHY; Silicon-proven PCIe Subsystem Offers High Performance, Low Risk Alternative to Traditional ASIC, FPGA Options

Ziptronix Revolutionizes Chip Interconnect for Three-Dimensional Integrated Circuits; New technology spurs greater integration, higher performance, and a scalable methodology to enable more than 4 million connections between bonded chips

X-EMI Adds Quad and Octal PCI Express Clock Buffers to Product Portfolio, Hits Taiwanese Market at Intel Developers Forum

Linear Technology Announces New Line of Power Modules

Atheros Single-Chip Technology for PCI Express WLANs Debuts in Lighter, Faster, Feature-Rich Notebooks

NEC Electronics America Introduces MOSFET Devices With Super Low On Resistance

Altera Completes Rollout of Low-Cost Cyclone II FPGA Family

Boost Converter Family Drives More LEDs from Lower Input Voltages

Conexant Introduces ADSL2plus Chipset with Integrated Voice and Support for High-Speed USB 2.0 Peripherals; New Device Provides Migration Path to VDSL2 and Enables WLAN Performance Improvements

Agere Systems Announces Chipset Solution for Mainstream Mobile Phones Capable of Cinema-Quality Video and CD-Quality Sound

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