Design Automation Conference Announces Call for Papers; EDA Industry's Premier Forum to be Held in San Francisco July 24 - 28, 2006

BOULDER, Colo.—(BUSINESS WIRE)—Oct. 18, 2005— The call for papers for the 43rd Design Automation Conference (DAC) is now available at the DAC Web site. Authors are invited to submit original technical papers describing recent and novel research or engineering developments in all areas of design automation tools and methodologies, silicon solutions and embedded system-on chip topics. As part of the regular program, DAC will feature a theme day on entertainment, games and multimedia. In addition, this year DAC is expanding the technical program in the areas of beyond-die integration and packaging, including chip-package co-design, system-in-package (SIP) and new integration techniques such as 3D and stacked designs, and new and emerging design technologies, such as nanotechnologies, quantum and biological computing and micro electro mechanical systems (MEMS).

The submission deadline for regular papers is Monday, December 19 before 5 p.m. MST. Proposals for special sessions, panels and tutorials are due Wednesday, November 2 before 5 p.m. MST. Selected authors will present their accepted submissions in technical sessions, tutorials and panels at the 43rd DAC to be held July 24 - 28, 2006 at Moscone Center in San Francisco.

Students are also invited to submit descriptions of original electronic designs, either circuit level or system level, for the annual student design contest. Winners of the student contest will be presented with their awards at the 43rd DAC, and will also be invited to present a poster at ISSCC in February 2006. The submission deadline for student papers is Tuesday, December 8, 2005 before 5 p.m. MST.

Details are available at http://www.dac.com/43rd/PDFs/43cfp.pdf. All submissions must be made electronically at the DAC Web site, www.dac.com

"As the industry's key annual event, DAC receives an overwhelming response with proposals representing the latest innovations in every sector of the electronics design," said Ellen M. Sentovich, 43rd DAC general chair. "As a result, attendees will be able to hear from the leading researchers and developers on the latest advancements in everything from die- and packaging-level issues, to IC design, to integration at the system level to help them meet the design challenges they face."

About DAC

DAC is the premier forum for the electronic design industry to exchange information on products, methodologies and processes. Attended by more than 10,000 developers, designers, researchers, managers and engineers from leading electronics companies and universities around the world, DAC includes more than 200 exhibitors and offers a robust technical program covering the electronics industry's hottest trends to bring people to the event.

The conference is sponsored by the Association for Computing Machinery's Special Interest Group on Design Automation (ACM/SIGDA), the Circuits and Systems Society and Computer Aided Network Design Technical Committee of the Institute of Electrical and Electronics Engineers (IEEE/CASS/CANDE), and the Electronic Design Automation Consortium (EDA Consortium). More details about DAC are found at: www.dac.com.



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