AMD sues Intel


Rambus Names Eric Ries Vice President and Managing Director of Japan Office

Fairchild Semiconductor Reports Results for the Second Quarter of 2005

National Semiconductor Announces Transfer of Military B-Level Logic Products to Arrow/Zeus Electronics

National Semiconductor Will Close Assembly and Test Plant in Singapore to Accelerate Cost Savings

AMD Reports Second Quarter Results; EPS of $0.03 Driven by Sales of $1.260 Billion

IBM Announces New CMOS Image Sensor Foundry Offering

TransDimension Licenses High-Speed USB Intellectual Property and Software Solution to Chipidea; Chipidea to Offer the Only Complete High-Speed SoC Solution; Reduces Risk and Time-to-Market

Semiconductor Industry Sees Globalization as Growth Opportunity

ChipMOS ANNOUNCES GRANT OF PATENT FOR DDRII DRAM SUBSTRATE-ON-CHIP PACKAGING TECHNOLOGY

Elpida Memory's 512 Megabit Mobile RAM(TM) Device Fits in Smaller Package for 3G Phones; 90 nm Process Technology Enables Smaller Die Size, Easier Implementation in Multi-Chip-Package and System-in-Package Designs

Keithley Publishes New Semiconductor Test Tutorial Handbook

System on a Chip Curriculum Achieves 4 Year Milestone Utilizing Innovative Collaborative Design Training Model for Three Pennsylvania Universities

Atmel's 0.18 Micron Radiation Hardened ASIC Integrates Up to 5.5 Million Usable Gates

IXYS Announces Reduced Revenues For The June Quarter

Tripath Announces Agreement to Settle Federal Securities Class Action Litigation

SEMI(R) Announces Mid-Year Consensus Forecast for Chip Equipment Industry

EEMBC Announces Benchmark Scores for AMCC's PowerPC(R) 440EP Processor

LSI Logic RapidChip(R) Platform ASIC Meets Military and Extended Industrial Temperature Range Specifications

FSMLabs Turbo-Charges AMD Processors in Embedded Applications

Alliance Semiconductor Announces Termination of Chief Financial Officer and Appointment of Interim Chief Financial Officer

Cypress Delivers Programmable System-on-Chip(TM) (PSoC(TM)) with Integrated Full-Speed USB; New Chip Provides Traditional PSoC Integration Benefits Plus USB and Cypress CapSense(TM) Technology for HID, UPS and other Applications

Zenasis Hires Dennis Harmon as CEO to Extend Leadership in Semiconductor Design Optimization Solutions

Arasan Releases SDIO Spec Ver 1.20 Compliant SDIO Device IP

New Software Tools From TI Simplify Multi-Platform Development In a Single IDE and Offer New Features to Reduce Debug Frustration

ANADIGICS Supplies 3G Power Amplifiers to UTStarcom

National Semiconductor Introduces New Family of DACs for Signal-Path, Portable Industrial and Consumer Applications

Alliance Semiconductor Introduces Industry's First Zero Cycle Slip EMI Reduction Device; Low-Voltage ICs Provide First True Drop in Solution to EMI Problems


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