Three-dimensional integrated circuits deliver the best performance, highest density, smallest footprint and lowest cost per function compared to competing integration methodologies now commonly in use by the industry. Ziptronix' ZiROC(R) bonding process is a distinctive, adhesive-free, room-temperature methodology that forms covalent bonds between semiconductor materials and supports vertical die-scale integration. Through this process, Ziptronix has developed a methodology that supports the construction of two or more layers of active transistors for an industry that has traditionally relied on devices consisting of a single layer of transistors.
As the former chief executive of two semiconductor companies, Nyborg will pinpoint market segments in the electronics industry where Ziptronix' 3D technology will prove to be most useful, and will help Ziptronix continue to build relationships with key players in the 3DIC supply chain and related design infrastructure.
"Ziptronix has developed an impressive portfolio of intellectual property that I believe holds solutions to a number of vexing problems facing the industry," Nyborg said. "As semiconductor designers struggle with deep submicron design difficulties, higher development costs and protracted time-to-market obstacles, the industry is demanding the integration of different technologies, more functionality, smaller silicon packages and reduced development time. Ziptronix provides the perfect solution at the right time in the industry's evolution. It's my job to let the genie out of the bottle and bring the benefits of this innovative technology to the greater semiconductor industry."
Mitch Mumma, a member of Ziptronix' Board of Directors and a general partner with Intersouth Partners adds, "Phil brings an outstanding record of successfully commercializing semiconductor technology and we are thrilled that he is on board. He brings the strategic vision and operating skills needed to drive Ziptronix' technology into production and establish it as the de facto standard for 3DIC integration."
Prior to being named president and CEO of Ziptronix, Nyborg served as CEO at JAM Technologies of Boston, where he transformed the company's business model from a provider of intellectual property to a fabless producer of industry-leading digital audio integrated circuits.
Prior to that, Nyborg was president and a founder of ONEX Communications, a producer of innovative, high-speed, telecommunications SoC integrated circuits. He oversaw the spinout of ONEX's architectural IP from a public company, raised $30 million in venture capital and built an all-star entrepreneurial team of 65 employees which successfully developed a 12-million gate IC prior to the company's acquisition. Over the course of his career, Nyborg has played a key role in new product and service introductions at SALIX (acquired by Tellabs), Whistle Communications (acquired by IBM), TRW, Ameritech/SBC, Transwitch, Hewlett-Packard, MCI and others. Working with TRW, he helped the company commercialize its RAMCUBE high-speed DRAM storage systems, introducing the product into markets such as digital cameras and digital animation. About Ziptronix Founded in October 2000, Ziptronix is a privately held company spun out from the Research Triangle Institute to commercialize ten years of research and development leading to the fabrication of three-dimensional integrated circuits. Its proven technology is being applied to development projects for major semiconductor manufacturers. Ziptronix provides in-house prototype development for 3D integrated circuits. Ziptronix corporate headquarters are in Research Triangle Park, North Carolina. More information about Ziptronix is available through the World Wide Web at http://www.ziptronix.com.
Christian Bateman Loomis Group 415-882-9494 Email Contact or Beth Roach Ziptronix 919-459-2410 Email Contact