Wurth Electronics Midcom (booth 949) is presenting for the first time a seminar on High-Speed EMI Prevention Techniques Wednesday, February 1 at 9:20am. Attendees can also stop by the booth on Wednesday and Thursday from 1-3pm to meet presenter Ismael Molina Alba, Product Manager for CMCs, and ask him questions about his presentation and more.
Yamaichi (booth 1049) will present 200GbE/400GbE, and Coherent Optics Interconnect Products. Its CFP2, CFP4, CFP2-64G and CFP8 connectors perform at high speed signal requirements 200GAUI-4 and 400GAUI-8 on 200G/400GbE, and also perform at 64Gbaud signal requirement for Future Coherent Optics. Yamaichi will display demos showcasing these connectors' performances.
For the full list of DesignCon 2017 exhibitors, please visit:
DesignCon Media & Association Partners
DesignCon is proud to partner with the following publications: Aspencore, Chinese American Semiconductor Professional Association (CASPA), Chip Design Magazine, ConnectorSupplier.com, EDA Café, Electronic System Design Alliance, Embedded Systems Engineering, How2Power, IBIS Open Forum, Microwave Journal, Signal Integrity Journal.
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com/santaclara. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.
DesignCon Public Relations
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