eSilicon to Present on HBM/2.5D at TSMC Open Innovation Platform Ecosystem Forum 2016
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eSilicon to Present on HBM/2.5D at TSMC Open Innovation Platform Ecosystem Forum 2016

SAN JOSE, CA--(Marketwired - September 15, 2016) - eSilicon, a leading semiconductor design and manufacturing solutions provider, will present Enabling the Expanding Cloud: High-Bandwidth Memory and 2.5D Solutions at the TSMC Open Innovation Platform (OIP) Ecosystem Forum on September 22, 2016.

The next generation of high-performance computing, graphics and networking applications have increasing needs for bandwidth. High-bandwidth memory (HBM) combined with 2.5D technology offers a tremendous increase in capacity and performance. Increased capacity because of the stacked memory in a smaller area and increased performance because of the interposer and shorter signal routing. The interposer allows the integration of highly parallel connections to the memory stacks inside the package, therefore it is able to offer huge capacity and performance increases.

This presentation will highlight the silicon characteristics of eSilicon's HBM PHY in TSMC's CLN28HPC technology. The presentation will also highlight TSMC CoWoS technology as well as complex ASICs that use high-bandwidth memory.

Lisa Minwell, senior director, IP marketing, eSilicon Corporation

September 22, 2016

San Jose McEnery Convention Center
150 West San Carlos Street
San Jose, CA 95113

About TSMC 2016 OIP Ecosystem Forum
The TSMC OIP Ecosystem Forum is a one-of-a-kind event that brings together the semiconductor design chain community and approximately 1,000 of director-level and above TSMC customer executives. The OIP Forum will feature a day-long, three-track technical conference along with an Ecosystem Pavilion that will host up to 80 member companies.

About eSilicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the automotive, communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results.

The right chip. Right now™

Sally Slemons
eSilicon Corporation 

Email contact

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