Advanced Packaging: Hot Topic at SEMICON Taiwan 2016

TAIPEI – August 16, 2016 -- SEMI announced today that over 43,000 visitors are expected to attend  SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei. Over 550 exhibitors, 16 themed pavilions, and more than 20 international forums are being readied to connect attendees with companies, people, products, and information forming the future of advanced electronics, including a major focus on advanced packaging.

Douglas Yu, senior director of Integrated Interconnect and Packaging Technology at TSMC, recently announced that TSMC needs to transition - from the world’s leading IC foundry - to the industry’s first System in Package (SiP) foundry (SEMICON West; July 2016).  Yu stated, “We are a wafer foundry, but we are doing some packaging business to survive and grow . . . Moore’s law is becoming more challenging, so we are preparing for those days.”  Sources say that TSMC’s chip packaging changes have led to improvements of 20 percent in both speed and packaging thickness and 10 percent in thermal performance.

SEMICON Taiwan is an exceptional event to learn about the latest advances in packaging. On September 7, the SEMI  Advanced Packaging Technology Symposium’s theme is “Fan Out Solutions – Cost-effective FO Solutions, 3D/SiP FO Solutions, and Fine Patterning.” Industry experts from a wide range of companies will present, including: Amkor, APIC Yamada, ASE, ASM, IEK, Kulicke & Soffa, Lam Research, Protec, Senju, SPTS, SUSS MicroTec Photonic Systems, and Ueno SEIKI.

On September 8, SEMICON Taiwan’s SiP Global Summit begins with a  2.5/3D-IC Technology Forum with presentations from TSMC, Amkor, ANSYS, ASE Group, EVG, Fraunhofer IZM, Hitachi Chemical, IBM, IMEC, NMC, and SPIL.  On September 9, the SiP Summit features an  Embedded and Wafer Level Package Technology Forum, with moderators from ASM Pacific Technology, ITRI, and SPIL.

Beyond packaging, many other innovation areas such as Smart Manufacturing, Semiconductor Materials and Executive Summit –Grand Opening Keynote session which always draws the most attention will be presented in technical and business programs, as well as on the show floor at the TechXPOTs, including:

  • High-Tech Facility TechXPOT: AccuDevice, Forbo Flooring, Hantech Engineering, Lumax International, Organo Technology, Particle Measuring, Rockwell Automation, Supenergy, Techgo Industrial, Trusval Technology, VIVOTEK, Wholetech Systems Hitech, and many more
  • Materials TechXPOT: AI Technology, Atotech Taiwan, CohPros International, CSI Chemical, Nippon Pulse Motor Trading (Taiwan), Tatsuta Electric Wire & Cable, and Uniwave Enterprise
  • New Product Launch TechXPOT: AblePrint Technology, Chemleader, Creating Nano Technologies, EVG-Jointech, First Elite Enterprise, SEIPI, Sigmatek, Sil-More Industrial, and YXLON/Teltec Semiconductor Pacific
  • Smart Manufacturing TechXPOT: Balluff Taiwan, Cimetrix, Dah Hsing Electric, and Gallant Precision Machining

For more information and registration for SEMICON Taiwan, please visit:

About SEMI

SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.  For more information about SEMI, visit and follow SEMI on  LinkedIn and  Twitter .

Media Contact

SEMI Taiwan
Jamie Liao
Email:  Email Contact
Phone: 886.3.560.1777 ext. 201

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