Company to present comprehensive LTE IP offerings, scaling from wearables through to LTE-Advanced-Pro and 5G at the conference, centered on the new CEVA-X2 DSP for PHY control
MOUNTAIN VIEW, Calif., July 18, 2016 - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that it will unveil the CEVA-X2 DSP targeting multi-RAT PHY control and other advanced modem workloads at the upcoming Linley Mobile & Wearables Conference 2016. CEVA's presentation at the conference will give an in-depth insight into the Company's comprehensive portfolio of LTE and associated IPs, scalable from low-power wearables through to high-performance LTE-Advanced Pro and 5G smartphones. In addition to the CEVA-X2 scalar DSP, CEVA's offerings include CEVA-XC vector DSPs, associated function-specific accelerators, optimized firmware and software reference chains.
The two-day conference will take place on July 26 – 27 in Santa Clara, California, with CEVA's presentation scheduled for Session 1: "The Road to 5G Wireless" on July 26. More information can be found here.
Linley Gwennap, principal analyst of the Linley Group, commented: "CEVA has a long and successful heritage in DSP IP for LTE, and in fact, powered the first-ever LTE phone launched in the United States in 2010. In the intervening years, they have consistently advanced their LTE capabilities by adding specialized DSPs for control and data planes and augmented these with essential hardware and software IPs that improve performance and accelerate time-to-market for their customers. As a result, CEVA is well-positioned for the future with a single, coherent portfolio of LTE reference architectures for LTE-Advanced-Pro use cases, from IoT through to smartphones and beyond."
The CEVA-X2 is designed for specific LTE-Advanced-Pro and 5G use cases where the emphasis of the DSP is PHY control processing. For example, where the PHY Datapath tasks such as per-channel measurement and decoding are not required to run on the DSP, the CEVA-X2 offers a 30%-65% better die size efficiency and 10%-25% better power efficiency compared to CEVA-X4 DSP. The CEVA-X2 is also ideal to run both the PHY and MAC for a range of other communication standards, including IEEE 802.15.4g, ZigBee, Thread and power line communications (PLC), combining power efficiency with minimal die area for such use cases.
Michael Boukaya, vice president and general manager, Wireless Business Unit at CEVA, commented: "The NEW CEVA-X architecture framework addresses the DSP 'design gap' that exists for companies developing next-generation modems, including those targeting LTE-Advanced Pro and 5G. Many existing DSP architectures simply don't have the performance to tackle these advanced use cases efficiently. The CEVA-X2 brings a host of powerful features that address the key challenges for multi-RAT PHY control processing, ensuring outstanding performance and power efficiency for even the most complex use cases."
The CEVA-X2 is the second DSP in The NEW CEVA-X family, offering a smaller and more power efficient alternative to the CEVA-X4 for use cases where the emphasis is on PHY control processing. The CEVA-X2 features a 64-bit SIMD data path and support for five-way VLIW instructions, together with a ten-stage pipeline and support for both fixed- and floating-point operations. The DSP is equipped with high-end features to compete with the best off-the-shelf controllers, including a dedicated 32-bit zero-latency Instruction Set Architecture (ISA), 32-bit hardware division and multiplication, dynamic branch prediction and ultra-fast context switching. For more information on The NEW CEVA-X family, visit http://www.ceva-dsp.com/CEVA-X-Family
About CEVA, Inc.
CEVA is the leading licensor of signal processing IP for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, computer vision and computational photography for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (Smart and Smart Ready), Wi-Fi (802.11 a/b/g/n/ac up to 4x4) and serial storage (SATA and SAS). Visit us at www.ceva-dsp.com