Chip Equipment Spending: SEMI Forecasts Flat 2016, Rebound in 2017

Equipment spending had a slow start in the beginning of the year and is expected to accelerate in the second half of the year. Spending growth will continue into 2017 driven by foundries, memory (both 3D NAND and DRAM), MPU, Power, and investments in China. Front-end wafer processing equipment is forecast to grow 2 percent in 2016 to total $29.3 billion, up from $28.8 billion in 2015.  The Test equipment segment is expected to total $3.4 billion, essentially flat when compared to last year. Assembly and packaging equipment and Other Front End equipment are forecast to contract this year, falling to $2.4 billion (-5 percent) and $1.9 billion (-2 percent), respectively.

"After a tepid 2015, device manufacturers are beginning to ramp their investments in key industry segments,” said Denny McGuirk, president and CEO of SEMI. “We expect capital spending to improve for the remainder of 2016 and into 2017.”

Taiwan is forecast to continue as the worldÂ’s largest spender with $9.5 billion estimated for 2016 and $10.0 billion for 2017. In 2016, China is projected to be the second largest spender at $6.4 billion, followed by Korea at $6.2 billion. For 2017, Taiwan is projected to maintain its leading position while the market in Korea will nudge past the market in China.

In 2016, year-over-year increases are expected to be largest for Rest of World (59 percent), China (31 percent), and Europe (6 percent). Projected year-over-year percentage increases for 2017 are forecast to be largest for Korea (30 percent increase), Europe (19 percent), Rest of World (18 percent) and China (13 percent).

Visit www.semi.org/en/MarketInfo.  For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International callers).

About SEMI

SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.  For more information about SEMI, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

Association Contact

Deborah Geiger/SEMI
Phone: 1.408.943.7988
Email: Email Contact



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