IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File

BANNOCKBURN, Ill., USA, April 5, 2016 — The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.

At Design Forum at IPC APEX EXPO, this newest release was applied to a real-world scenario, when founding IPC-2581 Consortium member company, Fujitsu Network Communications, Inc., unveiled a 20-layer complex board manufactured only using an IPC-2581B design file.

“IPC-2581B uses an intelligent XML schema format that accelerates printed circuit board fabrication, assembly and testing, and enables design data to be transferred between engineering and manufacturing without the need for human interpretation,” said Tsuyoshi Ueshima, Senior Vice President of Development at Fujitsu Network Communications, Inc. “This eliminates redundant labor and reduces the opportunity for error, resulting in high quality products that customers expect.”

For more information on IPC-2581B or the IPC-2581B Consortium, visit www.ipc-2581.com.

About IPC

IPC ( www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

 

Contact:

Sandy Gentry
IPC Communications Manager
+1 847-597-2871
Email Contact




Review Article Be the first to review this article
CST: Webinar

Aldec Simulator Evaluate Now

Featured Video
Jobs
ASIC Design Engineer for Infinera Corp at Sunnyvale, CA
Senior DSP Firmware Engineer for Cirrus Logic, Inc. at Austin, TX
RF IC Design Engineering Manager for Intel at Santa Clara, CA
Design Verification Engineer for Cirrus Logic, Inc. at Austin, TX
Senior Formal FAE Location OPEN for EDA Careers at San Jose or Anywhere, CA
DSP Tools Engineer for Cirrus Logic, Inc. at Austin, TX
Upcoming Events
Essentials of Electronic Technology: A Crash Course at Columbia MD - Jan 16 - 18, 2018
Essentials of Digital Technology at MD - Feb 13 - 14, 2018
IPC APEX EXPO 2018 at San Diego Convention Center San Diego CA - Feb 24 - 1, 2018
CST: Webinar series
Verific: SystemVerilog & VHDL Parsers
TrueCircuits: UltraPLL



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise